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TUSB4041IPAPRG4 ACTIVE

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking TUSB4041I
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-3-260C-168 HR

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
6.74x108 1.5 55 60 0.7 125 1000 7859 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.177171
97.535343
975353
0.247636
2476
Nickel and Its Alloys
Nickel
7440-02-0
0.000001
0.000551
6
0.000001
0
Not Categorized
Proprietary Materials
—
0.00002
0.011010
110
0.000028
0
Precious Metals
Gold
7440-57-5
0.000093
0.051198
512
0.000130
1
Precious Metals
Palladium
7440-05-3
0.004358
2.399146
23991
0.006091
61
Precious Metals
Silver
7440-22-4
0.000005
0.002753
28
0.000007
0
Sub-total
— —
0.181648
100
1000000
0.253893
2539
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.794954
80.000040
800000
1.111123
11111
Thermoplastics
Epoxy
85954-11-6
0.198738
19.999960
200000
0.277780
2778
Sub-total
— —
0.993692
100
1000000
1.388903
13889
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
41.9336
97.520000
975200
58.611444
586114
Copper and Its Alloys
Iron
7439-89-6
0.989
2.300000
23000
1.382345
13823
Copper and Its Alloys
Phosphorus
7723-14-0
0.0129
0.030000
300
0.018031
180
Zinc and Its Alloys
Zinc
7440-66-6
0.0645
0.150000
1500
0.090153
902
Sub-total
— —
43.0000
100
1000000
60.101973
601020
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
1.23656
95.120000
951200
1.728365
17284
Precious Metals
Gold
7440-57-5
0.01014
0.780000
7800
0.014173
142
Precious Metals
Palladium
7440-05-3
0.0533
4.100000
41000
0.074498
745
Sub-total
— —
1.30000
100
1000000
1.817036
18170
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
21.006602
87.999999
880000
29.361354
293614
Other Organic Materials
Carbon Black
1333-86-4
0.071613
0.299998
3000
0.100095
1001
Other Organic Materials
Chlorine
7782-50-5
0.000239
0.001001
10
0.000334
3
Thermoplastics
Epoxy
85954-11-6
2.792685
11.699002
116990
3.903393
39034
Sub-total
— —
23.871139
100
1000000
33.365176
333652
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
2.198593
100.000000
1000000
3.073018
30730
Sub-total
— —
2.198593
100
1000000
3.073018
30730
Total
— —
71.545072
— —
100
1000000

Qualification summary

No results found

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
65nm CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 7469 52924 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
QFP (with Thermal Pad) Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 1694 38743 Pass
QFP (with Thermal Pad) High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 1926 33503 Pass
QFP (with Thermal Pad) Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 4468 76940 Pass
QFP (with Thermal Pad) Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 2482 57494 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.