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Quality, reliability & packaging data download

UCD3138RMHT NOT RECOMMENDED FOR NEW DESIGNS

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Quality data will change based on assembly site

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Rating

—
RoHS Yes
REACH Yes
Device Marking 3138RMH
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-2-260C-1 YEAR

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
7.34x108 1.4 55 60 0.7 125 1000 8576 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.161372
96.545535
965455
0.221064
2211
Not Categorized
Proprietary Materials
—
0.000019
0.011367
114
0.000026
0
Precious Metals
Gold
7440-57-5
0.000981
0.586912
5869
0.001344
13
Precious Metals
Palladium
7440-05-3
0.004771
2.854391
28544
0.006536
65
Precious Metals
Silver
7440-22-4
0.000003
0.001795
18
0.000004
0
Sub-total
— —
0.167146
100
1000000
0.228974
2290
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
2.0575
80.000000
800000
2.818573
28186
Thermoplastics
Epoxy
85954-11-6
0.514375
20.000000
200000
0.704643
7046
Sub-total
— —
2.571875
100
1000000
3.523217
35232
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
30.105098
97.427498
974275
41.241033
412410
Copper and Its Alloys
Iron
7439-89-6
0.72615
2.350000
23500
0.994754
9948
Copper and Its Alloys
Phosphorus
7723-14-0
0.025493
0.082502
825
0.034923
349
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.004635
0.015000
150
0.006349
63
Zinc and Its Alloys
Zinc
7440-66-6
0.038625
0.125000
1250
0.052912
529
Sub-total
— —
30.900001
100
1000000
42.329972
423300
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.434698
95.119912
951199
0.595494
5955
Precious Metals
Gold
7440-57-5
0.003565
0.780088
7801
0.004884
49
Precious Metals
Palladium
7440-05-3
0.018737
4.100000
41000
0.025668
257
Sub-total
— —
0.457000
100
1000000
0.626045
6260
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
29.22612
88.000000
880000
40.036919
400369
Other Organic Materials
Carbon Black
1333-86-4
0.099635
0.300002
3000
0.136490
1365
Other Organic Materials
Chlorine
7782-50-5
0.000332
0.001000
10
0.000455
5
Thermoplastics
Epoxy
85954-11-6
3.885413
11.698999
116990
5.322635
53226
Sub-total
— —
33.211500
100
1000000
45.496499
454965
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
5.690402
100.000000
1000000
7.795293
77953
Sub-total
— —
5.690402
100
1000000
7.795293
77953
Total
— —
72.997924
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 1232 54768 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
QFN Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 16668 177751 Pass
QFN High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 13937 166805 Pass
QFN Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 39518 434508 Pass
QFN Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 21168 308384 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.