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Quality, reliability & packaging data download

LM393DGKR ACTIVE

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Rating

Catalog
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
Device Marking M9P, M9U, M9S
Lead finish/Ball material Sn
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1.25x108 8.0 55 60 0.7 125 1000 1463 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.04069
97.388765
973888
0.141273
1413
Precious Metals
Gold
7440-57-5
0.000089
0.213015
2130
0.000309
3
Precious Metals
Palladium
7440-05-3
0.001002
2.398219
23982
0.003479
35
Sub-total
— —
0.041781
100
1000000
0.145061
1451
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.091133
80.000176
800002
0.316408
3164
Thermoplastics
Epoxy
85954-11-6
0.022783
19.999824
199998
0.079101
791
Sub-total
— —
0.113916
100
1000000
0.395509
3955
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
11.158343
96.784995
967850
38.741092
387411
Copper and Its Alloys
Iron
7439-89-6
0.270932
2.350004
23500
0.940660
9407
Copper and Its Alloys
Phosphorus
7723-14-0
0.009223
0.079998
800
0.032022
320
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.000576
0.004996
50
0.002000
20
Precious Metals
Silver
7440-22-4
0.074939
0.650004
6500
0.260184
2602
Zinc and Its Alloys
Zinc
7440-66-6
0.014988
0.130003
1300
0.052037
520
Sub-total
— —
11.529001
100
1000000
40.027994
400280
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.075
100.000000
1000000
0.260395
2604
Sub-total
— —
0.075
100
1000000
0.260395
2604
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
14.27201
85.000000
850000
49.551556
495516
Other Organic Materials
Carbon Black
1333-86-4
0.092348
0.549998
5500
0.320627
3206
Thermoplastics
Epoxy
85954-11-6
2.426242
14.450002
144500
8.423765
84238
Sub-total
— —
16.790600
100
1000000
58.295948
582959
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.252047
100.000000
1000000
0.875092
8751
Sub-total
— —
0.252047
100
1000000
0.875092
8751
Total
— —
28.802345
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.042016
97.586808
975868
0.091279
913
Not Categorized
Proprietary Materials
—
0.000005
0.011613
116
0.000011
0
Precious Metals
Palladium
7440-05-3
0.001033
2.399257
23993
0.002244
22
Precious Metals
Silver
7440-22-4
0.000001
0.002323
23
0.000002
0
Sub-total
— —
0.043055
100
1000000
0.093536
935
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.086577
80.000185
800002
0.188087
1881
Thermoplastics
Epoxy
85954-11-6
0.021644
19.999815
199998
0.047021
470
Sub-total
— —
0.108221
100
1000000
0.235109
2351
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
27.923323
97.050000
970500
60.663038
606630
Copper and Its Alloys
Iron
7439-89-6
0.748075
2.600001
26000
1.625183
16252
Copper and Its Alloys
Phosphorus
7723-14-0
0.043158
0.149999
1500
0.093760
938
Zinc and Its Alloys
Zinc
7440-66-6
0.057544
0.199999
2000
0.125014
1250
Sub-total
— —
28.772100
100
1000000
62.506994
625070
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.026634
95.121429
951214
0.057862
579
Precious Metals
Gold
7440-57-5
0.000218
0.778571
7786
0.000474
5
Precious Metals
Palladium
7440-05-3
0.001148
4.100000
41000
0.002494
25
Sub-total
— —
0.028000
100
1000000
0.060830
608
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
0.588891
3.499999
35000
1.279358
12794
Other Inorganic Materials
Fused Silica
60676-86-0
14.385769
85.500004
855000
31.252887
312529
Other Organic Materials
Carbon Black
1333-86-4
0.084127
0.499998
5000
0.182765
1828
Thermoplastics
Epoxy
85954-11-6
1.766673
10.499998
105000
3.838073
38381
Sub-total
— —
16.825460
100
1000000
36.553082
365531
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.253373
100.000000
1000000
0.550449
5504
Sub-total
— —
0.253373
100
1000000
0.550449
5504
Total
— —
46.030209
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
BIPOLAR Life test 125C, 1000 Hours or Equivalent JEDEC Condition 770 24846 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
VSSOP Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 2387 34724 Pass
VSSOP High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 2363 22418 Pass
VSSOP Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 3850 60935 Pass
VSSOP Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 2387 48204 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.