Quality, reliability & packaging data download
LMKDB1108Z100RKPR
ACTIVE
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Rating
Catalog |
RoHS | Yes |
---|
REACH | Yes |
---|
Device Marking | LMKDB, 108Z100 |
---|
Lead finish/Ball material | NIPDAU |
---|
MSL rating/Peak reflow | Level-1-260C-UNLIM |
---|
MTBF/FIT estimates
MTBF/FIT | MTBF/FIT supporting data | |||||||||
---|---|---|---|---|---|---|---|---|---|---|
MTBF | FIT | Usage temp (°C) | Conf level (%) | Activation energy (eV) | Test temp (°C) | Test duration (hours) | Sample size | Fails | Additional comments | |
3.3x108 | 3.0 | 55 | 60 | 0.7 | 125 | 1000 | 3854 | 0 | — |
Material content
Homogeneous material level | Component level | ||||||
---|---|---|---|---|---|---|---|
Component | Substance | CAS Number | Amount (mg) | Percentage % | ppm | Percentage % | ppm |
Bond Wire | |||||||
Copper and Its Alloys
|
Copper
|
7440-50-8
|
0.201844
|
97.535094
|
975351
|
0.246675
|
2467
|
Nickel and Its Alloys
|
Nickel
|
7440-02-0
|
0.000001
|
0.000483
|
5
|
0.000001
|
0
|
Not Categorized
|
Proprietary Materials
|
— |
0.000023
|
0.011114
|
111
|
0.000028
|
0
|
Precious Metals
|
Gold
|
7440-57-5
|
0.000106
|
0.051221
|
512
|
0.000130
|
1
|
Precious Metals
|
Palladium
|
7440-05-3
|
0.004965
|
2.399188
|
23992
|
0.006068
|
61
|
Precious Metals
|
Silver
|
7440-22-4
|
0.000006
|
0.002899
|
29
|
0.000007
|
0
|
Sub-total
|
— | — |
0.206945
|
100
|
1000000
|
0.252909
|
2529
|
Die Attach Adhesive | |||||||
Precious Metals
|
Silver
|
7440-22-4
|
0.6889
|
80.000000
|
800000
|
0.841911
|
8419
|
Thermoplastics
|
Epoxy
|
85954-11-6
|
0.172225
|
20.000000
|
200000
|
0.210478
|
2105
|
Sub-total
|
— | — |
0.861125
|
100
|
1000000
|
1.052389
|
10524
|
Lead Frame | |||||||
Copper and Its Alloys
|
Copper
|
7440-50-8
|
43.49392
|
97.520000
|
975200
|
53.154334
|
531543
|
Copper and Its Alloys
|
Iron
|
7439-89-6
|
1.0258
|
2.300000
|
23000
|
1.253640
|
12536
|
Copper and Its Alloys
|
Phosphorus
|
7723-14-0
|
0.01338
|
0.030000
|
300
|
0.016352
|
164
|
Zinc and Its Alloys
|
Zinc
|
7440-66-6
|
0.0669
|
0.150000
|
1500
|
0.081759
|
818
|
Sub-total
|
— | — |
44.60000
|
100
|
1000000
|
54.506085
|
545061
|
Lead Frame Plating | |||||||
Nickel and Its Alloys
|
Nickel
|
7440-02-0
|
1.293632
|
95.120000
|
951200
|
1.580960
|
15810
|
Precious Metals
|
Gold
|
7440-57-5
|
0.010608
|
0.780000
|
7800
|
0.012964
|
130
|
Precious Metals
|
Palladium
|
7440-05-3
|
0.05576
|
4.100000
|
41000
|
0.068145
|
681
|
Sub-total
|
— | — |
1.360000
|
100
|
1000000
|
1.662069
|
16621
|
Mold Compound | |||||||
Other Inorganic Materials
|
Fused Silica
|
60676-86-0
|
28.90821
|
90.000001
|
900000
|
35.328999
|
353290
|
Other Organic Materials
|
Carbon Black
|
1333-86-4
|
0.160601
|
0.499999
|
5000
|
0.196272
|
1963
|
Thermoplastics
|
Epoxy
|
85954-11-6
|
3.051422
|
9.500000
|
95000
|
3.729172
|
37292
|
Sub-total
|
— | — |
32.120233
|
100
|
1000000
|
39.254443
|
392544
|
Semiconductor Device | |||||||
Ceramics / Glass
|
Doped Silicon
|
7440-21-3
|
2.677423
|
100.000000
|
1000000
|
3.272104
|
32721
|
Sub-total
|
— | — |
2.677423
|
100
|
1000000
|
3.272104
|
32721
|
Total
|
— | — |
81.825726
|
— | — |
100
|
1000000
|
Qualification summary
Stress | Reference | Min lot qty | SS / lot | Condition | Duration | Result | Notes |
---|---|---|---|---|---|---|---|
HTOL | JESD22-A108 | 3 | 77 | Life test, 125C | 1000 hours | Pass | Or equivalent JEDEC condition |
HTSL | JESD22-A103 | 3 | 25 | High temp storage bake, 150C | 1000 hours | Pass | Or equivalent JEDEC condition |
AC/UHAST | JESD22-A102/JESD22-A118 | 3 | 25 | Unbiased HAST 130C / 85% RH | 96 hours | Pass | Or equivalent JEDEC condition |
THB/HAST | JESD22-A101/JESD22-A110 | 3 | 25 | HAST 130C/85%RH | 96 hours | Pass | Or equivalent JEDEC condition |
TC | JESD22-A104 | 3 | 25 | Temperature cycle -65/150C | 500 cycles | Pass | Or equivalent JEDEC condition |
SD | J-STD-002 | 3 | 22 | Per specification | >95% lead coverage | Pass | — |
HBM | JS-001 | 1 | 3 | ESD - HBM | Classification | See data sheet | — |
CDM | JS-002 | 1 | 3 | ESD - CDM | Classification | See data sheet | — |
LU | JESD78 | 1 | 3 | Latch-up | Per JESD78 | Pass | As applicable per JESD78 |
MSL | J-STD-020 | — | — | Per J-STD-020 | Classification | See data sheet | — |
Ongoing reliability monitoring
FAB process reliability data
Fab Process | Reliability Test | Rolling Year (2Q2023 - 1Q2024) Sample Size | Cumulative Sample Size | Disposition |
---|---|---|---|---|
130nm CMOS | Life test 125C, 1000 Hours or Equivalent JEDEC Condition | 77 | 20205 | Pass |
Assembly process reliability data
Package Family | Reliability Test | Rolling Year (2Q2023 - 1Q2024) Sample Size | Cumulative Sample Size | Disposition |
---|---|---|---|---|
QFN | Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition | 12530 | 145993 | Pass |
QFN | High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition | 15261 | 136459 | Pass |
QFN | Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition | 42510 | 348451 | Pass |
QFN | Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition | 24797 | 261412 | Pass |