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Quality, reliability & packaging data download

TUSB522PRGET ACTIVE

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking TUSB, 522P
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-2-260C-1 YEAR

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
6.74x108 1.5 55 60 0.7 125 1000 7859 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.084058
96.545150
965451
0.192651
1927
Not Categorized
Proprietary Materials
—
0.00001
0.011486
115
0.000023
0
Precious Metals
Gold
7440-57-5
0.000511
0.586911
5869
0.001171
12
Precious Metals
Palladium
7440-05-3
0.002485
2.854157
28542
0.005695
57
Precious Metals
Silver
7440-22-4
0.000002
0.002297
23
0.000005
0
Sub-total
— —
0.087066
100
1000000
0.199545
1995
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.222467
79.999928
799999
0.509868
5099
Thermoplastics
Epoxy
85954-11-6
0.055617
20.000072
200001
0.127468
1275
Sub-total
— —
0.278084
100
1000000
0.637336
6373
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
16.942642
97.427493
974275
38.830551
388306
Copper and Its Alloys
Iron
7439-89-6
0.408665
2.350000
23500
0.936612
9366
Copper and Its Alloys
Phosphorus
7723-14-0
0.014347
0.082501
825
0.032882
329
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.002609
0.015003
150
0.005980
60
Zinc and Its Alloys
Zinc
7440-66-6
0.021738
0.125003
1250
0.049821
498
Sub-total
— —
17.390001
100
1000000
39.855846
398558
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.370968
95.120000
951200
0.850215
8502
Precious Metals
Gold
7440-57-5
0.003042
0.780000
7800
0.006972
70
Precious Metals
Palladium
7440-05-3
0.01599
4.100000
41000
0.036647
366
Sub-total
— —
0.390000
100
1000000
0.893834
8938
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
21.667778
88.000004
880000
49.660009
496600
Other Organic Materials
Carbon Black
1333-86-4
0.073867
0.299998
3000
0.169295
1693
Other Organic Materials
Chlorine
7782-50-5
0.000246
0.000999
10
0.000564
6
Thermoplastics
Epoxy
85954-11-6
2.880583
11.698999
116990
6.601959
66020
Sub-total
— —
24.622474
100
1000000
56.431827
564318
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.864622
100.000000
1000000
1.981612
19816
Sub-total
— —
0.864622
100
1000000
1.981612
19816
Total
— —
43.632247
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
65nm CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 7700 51230 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
QFN Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 14477 175184 Pass
QFN High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 13550 164713 Pass
QFN Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 40279 428502 Pass
QFN Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 22747 305432 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.