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Quality, reliability & packaging data download

LM393D OBSOLETE

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Rating

Catalog
RoHS —
REACH —
Device Marking LM393
Lead finish/Ball material —
MSL rating/Peak reflow —

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1.6x109 0.6 55 60 0.7 125 1000 41301 1 —

Material content

No results found

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
BIPOLAR Life test 125C, 1000 Hours or Equivalent JEDEC Condition 1540 24692 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
SOIC Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 4522 83092 Pass
SOIC High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 3530 70790 Pass
SOIC Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 12607 184408 Pass
SOIC Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 8855 135910 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.