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LM393DGKR ACTIVE

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Rating

Catalog
RoHS Yes
RoHS Yes
RoHS Yes
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
REACH Yes
REACH Yes
REACH Yes
Device Marking M9P, M9U, M9S
Lead finish/Ball material Sn
Lead finish/Ball material Sn
Lead finish/Ball material NiPdAu
Lead finish/Ball material NiPdAu
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1.25x108 8.0 55 60 0.7 125 1000 1463 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.04069
97.388765
973888
0.141273
1413
Precious Metals
Gold
7440-57-5
0.000089
0.213015
2130
0.000309
3
Precious Metals
Palladium
7440-05-3
0.001002
2.398219
23982
0.003479
35
Sub-total
— —
0.041781
100
1000000
0.145061
1451
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.091133
80.000176
800002
0.316408
3164
Thermoplastics
Epoxy
85954-11-6
0.022783
19.999824
199998
0.079101
791
Sub-total
— —
0.113916
100
1000000
0.395509
3955
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
11.158343
96.784995
967850
38.741092
387411
Copper and Its Alloys
Iron
7439-89-6
0.270932
2.350004
23500
0.940660
9407
Copper and Its Alloys
Phosphorus
7723-14-0
0.009223
0.079998
800
0.032022
320
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.000576
0.004996
50
0.002000
20
Precious Metals
Silver
7440-22-4
0.074939
0.650004
6500
0.260184
2602
Zinc and Its Alloys
Zinc
7440-66-6
0.014988
0.130003
1300
0.052037
520
Sub-total
— —
11.529001
100
1000000
40.027994
400280
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.075
100.000000
1000000
0.260395
2604
Sub-total
— —
0.075
100
1000000
0.260395
2604
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
14.27201
85.000000
850000
49.551556
495516
Other Organic Materials
Carbon Black
1333-86-4
0.092348
0.549998
5500
0.320627
3206
Thermoplastics
Epoxy
85954-11-6
2.426242
14.450002
144500
8.423765
84238
Sub-total
— —
16.790600
100
1000000
58.295948
582959
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.252047
100.000000
1000000
0.875092
8751
Sub-total
— —
0.252047
100
1000000
0.875092
8751
Total
— —
28.802345
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.026798
95.159973
951600
0.093288
933
Precious Metals
Gold
7440-57-5
0.000209
0.742161
7422
0.000728
7
Precious Metals
Palladium
7440-05-3
0.001154
4.097866
40979
0.004017
40
Sub-total
— —
0.028161
100
1000000
0.098032
980
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.06306
80.000000
800000
0.219521
2195
Thermoplastics
Epoxy
85954-11-6
0.015765
20.000000
200000
0.054880
549
Sub-total
— —
0.078825
100
1000000
0.274401
2744
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
11.1297
96.780000
967800
38.744059
387441
Copper and Its Alloys
Iron
7439-89-6
0.27025
2.350000
23500
0.940778
9408
Copper and Its Alloys
Phosphorus
7723-14-0
0.0092
0.080000
800
0.032027
320
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.00115
0.010000
100
0.004003
40
Precious Metals
Silver
7440-22-4
0.07475
0.650000
6500
0.260215
2602
Zinc and Its Alloys
Zinc
7440-66-6
0.01495
0.130000
1300
0.052043
520
Sub-total
— —
11.50000
100
1000000
40.033125
400331
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.07
100.000000
1000000
0.243680
2437
Sub-total
— —
0.07
100
1000000
0.243680
2437
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
14.343596
84.999999
850000
49.932085
499321
Other Organic Materials
Carbon Black
1333-86-4
0.092812
0.550003
5500
0.323092
3231
Thermoplastics
Epoxy
85954-11-6
2.438411
14.449998
144500
8.488453
84885
Sub-total
— —
16.874819
100
1000000
58.743630
587436
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.174406
100.000000
1000000
0.607132
6071
Sub-total
— —
0.174406
100
1000000
0.607132
6071
Total
— —
28.726211
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.042016
97.586808
975868
0.091279
913
Not Categorized
Proprietary Materials
—
0.000005
0.011613
116
0.000011
0
Precious Metals
Palladium
7440-05-3
0.001033
2.399257
23993
0.002244
22
Precious Metals
Silver
7440-22-4
0.000001
0.002323
23
0.000002
0
Sub-total
— —
0.043055
100
1000000
0.093536
935
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.086577
80.000185
800002
0.188087
1881
Thermoplastics
Epoxy
85954-11-6
0.021644
19.999815
199998
0.047021
470
Sub-total
— —
0.108221
100
1000000
0.235109
2351
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
27.923323
97.050000
970500
60.663038
606630
Copper and Its Alloys
Iron
7439-89-6
0.748075
2.600001
26000
1.625183
16252
Copper and Its Alloys
Phosphorus
7723-14-0
0.043158
0.149999
1500
0.093760
938
Zinc and Its Alloys
Zinc
7440-66-6
0.057544
0.199999
2000
0.125014
1250
Sub-total
— —
28.772100
100
1000000
62.506994
625070
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.026634
95.121429
951214
0.057862
579
Precious Metals
Gold
7440-57-5
0.000218
0.778571
7786
0.000474
5
Precious Metals
Palladium
7440-05-3
0.001148
4.100000
41000
0.002494
25
Sub-total
— —
0.028000
100
1000000
0.060830
608
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
0.588891
3.499999
35000
1.279358
12794
Other Inorganic Materials
Fused Silica
60676-86-0
14.385769
85.500004
855000
31.252887
312529
Other Organic Materials
Carbon Black
1333-86-4
0.084127
0.499998
5000
0.182765
1828
Thermoplastics
Epoxy
85954-11-6
1.766673
10.499998
105000
3.838073
38381
Sub-total
— —
16.825460
100
1000000
36.553082
365531
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.253373
100.000000
1000000
0.550449
5504
Sub-total
— —
0.253373
100
1000000
0.550449
5504
Total
— —
46.030209
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.028681
97.534517
975345
0.062364
624
Not Categorized
Proprietary Materials
—
0.000003
0.010202
102
0.000007
0
Precious Metals
Gold
7440-57-5
0.000015
0.051010
510
0.000033
0
Precious Metals
Palladium
7440-05-3
0.000706
2.400871
24009
0.001535
15
Precious Metals
Silver
7440-22-4
0.000001
0.003401
34
0.000002
0
Sub-total
— —
0.029406
100
1000000
0.063940
639
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.059907
79.999733
799997
0.130262
1303
Thermoplastics
Epoxy
85954-11-6
0.014977
20.000267
200003
0.032566
326
Sub-total
— —
0.074884
100
1000000
0.162828
1628
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
27.923323
97.050000
970500
60.716413
607164
Copper and Its Alloys
Iron
7439-89-6
0.748075
2.600001
26000
1.626613
16266
Copper and Its Alloys
Phosphorus
7723-14-0
0.043158
0.149999
1500
0.093843
938
Zinc and Its Alloys
Zinc
7440-66-6
0.057544
0.199999
2000
0.125124
1251
Sub-total
— —
28.772100
100
1000000
62.561992
625620
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.026634
95.121429
951214
0.057913
579
Precious Metals
Gold
7440-57-5
0.000218
0.778571
7786
0.000474
5
Precious Metals
Palladium
7440-05-3
0.001148
4.100000
41000
0.002496
25
Sub-total
— —
0.028000
100
1000000
0.060883
609
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
0.591851
3.500000
35000
1.286920
12869
Other Inorganic Materials
Fused Silica
60676-86-0
14.458076
85.500002
855000
31.437609
314376
Other Organic Materials
Carbon Black
1333-86-4
0.08455
0.499999
5000
0.183845
1838
Thermoplastics
Epoxy
85954-11-6
1.775553
10.499999
105000
3.860759
38608
Sub-total
— —
16.910030
100
1000000
36.769133
367691
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.175324
100.000000
1000000
0.381224
3812
Sub-total
— —
0.175324
100
1000000
0.381224
3812
Total
— —
45.989744
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.029481
97.535235
975352
0.064120
641
Not Categorized
Proprietary Materials
—
0.000003
0.009925
99
0.000007
0
Precious Metals
Gold
7440-57-5
0.000016
0.052935
529
0.000035
0
Precious Metals
Palladium
7440-05-3
0.000725
2.398597
23986
0.001577
16
Precious Metals
Silver
7440-22-4
0.000001
0.003308
33
0.000002
0
Sub-total
— —
0.030226
100
1000000
0.065741
657
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.047071
79.999660
799997
0.102378
1024
Thermoplastics
Epoxy
85954-11-6
0.011768
20.000340
200003
0.025595
256
Sub-total
— —
0.058839
100
1000000
0.127973
1280
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
27.923323
97.050000
970500
60.732374
607324
Copper and Its Alloys
Iron
7439-89-6
0.748075
2.600001
26000
1.627040
16270
Copper and Its Alloys
Phosphorus
7723-14-0
0.043158
0.149999
1500
0.093867
939
Zinc and Its Alloys
Zinc
7440-66-6
0.057544
0.199999
2000
0.125156
1252
Sub-total
— —
28.772100
100
1000000
62.578438
625784
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.026634
95.121429
951214
0.057928
579
Precious Metals
Gold
7440-57-5
0.000218
0.778571
7786
0.000474
5
Precious Metals
Palladium
7440-05-3
0.001148
4.100000
41000
0.002497
25
Sub-total
— —
0.028000
100
1000000
0.060899
609
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
0.593276
3.500002
35000
1.290357
12904
Other Inorganic Materials
Fused Silica
60676-86-0
14.492878
85.499997
855000
31.521566
315216
Other Organic Materials
Carbon Black
1333-86-4
0.084754
0.500002
5000
0.184337
1843
Thermoplastics
Epoxy
85954-11-6
1.779827
10.499999
105000
3.871069
38711
Sub-total
— —
16.950735
100
1000000
36.867330
368673
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.137758
100.000000
1000000
0.299619
2996
Sub-total
— —
0.137758
100
1000000
0.299619
2996
Total
— —
45.977658
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
BIPOLAR Life test 125C, 1000 Hours or Equivalent JEDEC Condition 1540 24692 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
VSSOP Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 2079 34082 Pass
VSSOP High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 2350 21532 Pass
VSSOP Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 3696 59626 Pass
VSSOP Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 2233 47295 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.