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Quality, reliability & packaging data download

TS2PCIE412RUAR ACTIVE

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking SH412
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
5.44x107 18.4 55 60 0.7 125 1000 1401 1 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Other Nonferrous Metals and Alloys
Calcium
7440-70-2
0.000003
0.000189
2
0.000004
0
Precious Metals
Gold
7440-57-5
1.58332
99.998926
999989
1.903937
19039
Precious Metals
Silver
7440-22-4
0.000014
0.000884
9
0.000017
0
Sub-total
— —
1.583337
100
1000000
1.903958
19040
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.306043
79.999948
799999
0.368016
3680
Thermoplastics
Epoxy
85954-11-6
0.076511
20.000052
200001
0.092004
920
Sub-total
— —
0.382554
100
1000000
0.460020
4600
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
44.649652
97.596999
975970
53.691059
536911
Copper and Its Alloys
Iron
7439-89-6
1.020203
2.230001
22300
1.226791
12268
Copper and Its Alloys
Phosphorus
7723-14-0
0.016012
0.035000
350
0.019254
193
Zinc and Its Alloys
Zinc
7440-66-6
0.063134
0.138001
1380
0.075918
759
Sub-total
— —
45.749001
100
1000000
55.013022
550130
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.782838
95.120049
951200
0.941360
9414
Precious Metals
Gold
7440-57-5
0.006419
0.779951
7800
0.007719
77
Precious Metals
Palladium
7440-05-3
0.033743
4.100000
41000
0.040576
406
Sub-total
— —
0.823000
100
1000000
0.989655
9897
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
30.068307
90.500002
905000
36.157040
361570
Other Organic Materials
Carbon Black
1333-86-4
0.166123
0.499999
5000
0.199762
1998
Thermoplastics
Epoxy
85954-11-6
2.990218
8.999999
90000
3.595727
35957
Sub-total
— —
33.224648
100
1000000
39.952529
399525
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
1.397772
100.000000
1000000
1.680816
16808
Sub-total
— —
1.397772
100
1000000
1.680816
16808
Total
— —
83.160312
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 77 53613 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
QFN Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 13297 170324 Pass
QFN High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 12351 160535 Pass
QFN Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 39005 414094 Pass
QFN Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 21145 298413 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.