BUF634ADDAEVM

210-MHz, 250-mA high-speed buffer evaluation module

BUF634ADDAEVM

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Overview

The BUF634ADDAEVM is an evaluation module (EVM) for the BUF634A high-speed buffer in the DDA (8-pin SO8 w/thermal pad) package. The BUF634ADDAEVM features two BUF634AIDDA devices and is designed to quickly demonstrate the functionality and versatility of the buffer. Optionally, the buffers can be configured as outputs for a dual SOIC amplifier in a composite loop. The EVM is ready to connect to power, signal sources, and test instruments by using onboard connectors. The default configuration uses split supplies and subminiature version A (SMA) input and output connecters with a 50-Ω output impedance for standard test equipment. The EVM can be easily configured for other connections and single-supply operation. Dual-channel path configuration is also available for the TM audio input jacks and a 3.5-mm output jack.

Features
  • Easy evaluation with standard benchtop test equipment
  • Includes connections for audio inputs and outputs
  • Board has option to form composite loop with dual SOIC op-amp
  • Configurable for split or single supply operation
High-speed op amps (GBW>=50MHz)
BUF634A 210-MHz, 250-mA high-speed buffer

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Evaluation board

BUF634ADDAEVM – 210-MHz, 250-mA high-speed buffer evaluation module

TI's Standard Terms and Conditions for Evaluation Items apply.

Technical documentation

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Type Title Date
* User guide BUF634Axxx Evaluation Module User's Guide Dec. 22, 2020
More literature BUF634ADDAEVM EU Declaration of Conformity (DoC) Aug. 03, 2020

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