Automotive Capacitive Proximity Kick to Open Detection Reference Design
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Key Document


This TI design showcases proximity sensitivity using TI's FDC1004 EVM for an automotive kick to open application within a plastic bumper. This TI design also showcases test results that include exposure to mud and water on the bumper to determine the impact of common environmental factors.

  • Input Offset Capacitance up to 100pF the large offset capacitance capability allows for the use of remote sensors and allows the use of long cables. It also allows tracking and compensating for environmental changes over time, i.e. temperature and humidity.
  • Two channels shield drive up to 400pF the large shield drive can reduce environmental interferences such as EMI, noise and proximity from undesired targets and help focus the sensing direction of a capacitive sensor, thus enhancing its resolution.
  • Effective resolution (noise floor) of 16 bits allowing far object sensing with a small, inexpensive conductive sensor.
  • Four measurement channels multiple channels allows multiple applications where one channel can be used as environmental sensor to track and compensate for environmental (e.g. temperature, humidity) changes.
  • Small 3mmx3mm footprint enableing using the device in space constrained applications.

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Design Files

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TI Devices (1)

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Part Number Name Product Family Sample & Buy Design Kits & Evaluation Modules
FDC1004  4-Ch, 16-bit, capacitance to digital converter with active shield driver  Specialty sensors  Sample & Buy View Design Kits & Evaluation Modules

CAD/CAE symbols

Part # Package | Pins CAD File (.bxl) STEP Model (.stp)
FDC1004 Download Download
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Technical documentation

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User guide (2)
Title Type Size (KB) Date
PDF 990 04 Mar 2015
PDF 252 04 Mar 2015
Design files (3)
Title Type Size (KB) Date
ZIP 258 04 Mar 2015
PDF 108 04 Mar 2015
PDF 171 04 Mar 2015

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