Isolated power and data interface for low-power applications reference design


Design files


This reference design provides power and data isolation for low and ultra-low power applications. Generating isolated and non-isolated power rails with a high efficiency and containing a power efficient isolated data interface for three forward- plus one reverse-direction channels. Targeted applications are isolated loop powered 4- to 20-mA transmitters. This design can be adapted to other applications requiring highly-efficient power conversion and isolated data transmission while being powered from sources with a limited current capability.

  • Power input 5 VDC, source needs to be current limited to < 30 mA
  • Ultra-low power, isolated data interface
    • 5, 16, 130 μA per channel at 10, 100, 1000 kbps
    • 3 forward-channels, 1 reverse-channel
  • Isolated 10-mA DC/DC Converter
    • Efficiency up to 86.5%
  • 3.3-V, 10-mA buck converter on non-isolated side
    • Efficiency up to 93%, VOUT ripple < 15 mVpp
  • 3.3-V, 10-mA buck converter on isolated side
    • Efficiency up to 92%, VOUT ripple < 20 mVpp
  • 3.0-V, 10-mA LDOs
    • IQ = 16 μA @ Iout = 1 mA
    • PSRR > 36 dB at ≤ 200 kHz
Output voltage options TIDA-010018.1 TIDA-010018.2
Vin (Min) (V) 4.4 4.4
Vin (Max) (V) 5.25 5.25
Vout (Nom) (V) 3.3 3.3
Iout (Max) (A) .01 .01
Output Power (W) .033 .033
Isolated/Non-Isolated Non-Isolated Isolated
Input Type DC DC
Topology Buck- Synchronous Buck- Synchronous^Half Bridge- Hard Switched
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDUEN0.PDF (2267 K)

Reference design overview and verified performance test data

TIDRYV8.PDF (1417 K)

Detailed schematic diagram for design layout and components


Complete listing of design components, reference designators, and manufacturers/part numbers


Detailed overview of design layout for component placement

TIDRYW2.ZIP (1515 K)

Files used for 3D models or 2D drawings of IC components

TIDCF98.ZIP (762 K)

Design file that contains information on physical board layer of design PCB

TIDRYW1.PDF (1213 K)

PCB layer plot file used for generating PCB design layout


Includes TI products in the design and potential alternatives.

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Technical documentation

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Type Title Date
* Design guide Isolated power and data interface for low-power applications reference design Jan. 30, 2019
Application note How to Isolate Two-Wire Loop-Powered Field Transmitters (Rev. B) Oct. 07, 2019

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