AM570x 6-Layer PCB Reference Design
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Key Document


System level cost savings tactics are a focus of this board design. Key areas affecting fabrication costs are number of PCB layers and via drill size. The AM570x features a package with via channel arrays. These channels make it possible to build the PCB in only 6-layers while still achieving 100% signal breakout. The added room helps with signal breakout and routing while avoiding the need for smaller, costlier drill bits for the vias. Another added benefit of larger vias is improved via reliability and electrical performance. This reference design is based on the Texas Instruments Sitara™ AM570x System on Chip. The source documents provided represent a board design that’s been tested for stability and compliance in certain key areas. Those areas are DDR stability, HDMI performance, oscilloscope captures of the power sequencing, and a Power Design Network (PDN) Integrity Analysis.

  • Sitara™ AM570x System on Chip (17 x 17 mm)
  • Reference design files for a 6-layer board
  • 100% signal breakout and routing for all signals
  • SerDes routing for DDR, HDMI, USB3, & CSI-2
  • Reference power design with TPS65916 PMIC

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Schematic/Block Diagram

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Design Guide

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TI Devices (2)

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Part Number Name Product Family Sample & Buy Design Kits & Evaluation Modules
AM5708  Sitara processor: cost optimized Arm Cortex-A15 & DSP, multimedia and secure boot  Processors  Sample & Buy View Design Kits & Evaluation Modules
TPS65916  Power Management Unit (PMU) for Processor  Power management  Sample & Buy View Design Kits & Evaluation Modules

CAD/CAE symbols

Part # Package | Pins CAD File (.bxl) STEP Model (.stp)
AM5708 Download Download
TPS65916 Download Download

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Technical documentation

See the Important Notice and Disclaimer covering reference designs and other TI resources.

Data sheet (1)
Title Type Size (KB) Date
PDF 4359 15 Apr 2019
User guide (1)
Title Type Size (KB) Date
PDF 1230 07 Feb 2018
Design files (7)
Title Type Size (KB) Date
ZIP 37 08 Feb 2018
ZIP 937 29 Nov 2017
ZIP 5105 29 Nov 2017
PDF 1127 29 Nov 2017
PDF 118 29 Nov 2017
PDF 50 29 Nov 2017
PDF 944 29 Nov 2017

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