TPS61254EVM-711

Evaluation Module for TPS61254, Tiny Boost Converter with Input Current Limit and Bypas

TPS61254EVM-711

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Overview

The TPS6125XEVM-711 enables test and evaluation of the Texas Instruments' TPS61254 and TPS61256 (TPS6125x) devices, a series of 3.5-MHz, up to 5.5-V, step-up dc-dc converters. This user's guide includes EVM specifications, the schematic diagram, bill of materials, and board layout. The TPS6125x device provides a power-supply solution for products powered by either a three-cell alkaline, NiCd or NiMH battery, or a single-cell Li-Ion or Li-polymer battery. The wide input voltage range is ideal for portable power applications such as mobile phones or computer peripherals. In addition, the TPS6125x can also maintain its output biased at the input voltage level. In this mode, the synchronous rectifier is current-limited, and allows external loads (for example, an audio amplifier) to be powered with a restricted supply. In this mode, quiescent current is reduced to 18 μA. Input current in shutdown mode is less than 5 μA in order to maximize battery life.

Features
  • Up to 92% Efficiency
  • VIN Range from 2.3 V to 5.5 V
  • 18-μA Quiescent Current in Standby Mode
  • 30-μA Quiescent Current in Normal Operation
  • 100% Duty-Cycle Mode when VIN > VOUT
  • Selectable Standby Mode or True Load Disconnect During Shutdown
  • Double-sided, two-active-layer printed circuit board (PCB) with all components on top side
  • Active converter area of approximately 25 mm2
Boost converters (integrated switch)
TPS61254 3.5-MHz, 4.5-V, 800-mA load boost converter in 1.2-mm x 1.3-mm WCSP

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Evaluation board

TPS61254EVM-711 – Evaluation Module for TPS61254, Tiny Boost Converter with Input Current Limit and Bypas

TI's Standard Terms and Conditions for Evaluation Items apply.

Technical documentation

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Type Title Date
* User guide TPS6125xEVM User Guide Sep. 18, 2011
Certificate TPS61254EVM-711 EU Declaration of Conformity (DoC) Jan. 02, 2019
Data sheet TPS6125x 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging datasheet (Rev. G) Jun. 16, 2016

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