2020 Automotive TI Tech Day session

Due to the widespread adoption of ADAS applications, the demand for cost-effective and high-performing automotive camera modules is growing. To streamline the design process, engineers should beware of these top for challenges: 1) solution size, 2) design scalability, 3) thermal performance and 4) PSRR and noise performance. This presentation will detail how TI's TPS650330-Q1 automotive-grade PMIC helps to address these common design challenges with a variety of integrated features.