Power design with thermal reliability in mind
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17 DEC 2020
| When it comes to improving the thermal reliability of your design, it is important to understand how the package technology of your chosen DC/DC regulator impacts thermal performance. Knowing the tradeoffs of common package technologies, such as HotRod™ and standard wirebond QFN, can help you avoid redesign later. Learn how to pick the correct DC/DC package for optimal thermal design and how to leverage the data sheet parameters before ever having to touch a soldering iron. |