The TPS54325T buck converter features Texas Instrument's first thermally enhanced step-down regulator. Through removing the top side mold compound and exposing the die, the thermally enhanced package is able to deliver more power at higher ambient temperatures than standard over molded packages.

- Improve junction-to-ambient thermal resistance (RθJA) by up to ~4°C/W

- Improve junction-to-case (top) thermal resistance (RθJC(top)) by up to ~10.6°C/W

- Deliver ~10% more power at full load at 100°C ambient temperature.