Double the density: reshaping power modules with MagPack™ technology

As the world consumes more power and applications get smaller, there is a constant demand to reduce size while increasing efficiency. A global team of designers, researchers and manufacturers at TI has improved power modules through our proprietary MagPack™ packaging technology. MagPack technology provides previously unachievable performance levels for designers of industrial, enterprise and communications applications, reducing the power solution size in half and doubling the power density.