Reliability calculators
The below calculators can be used to help model estimated product lifetimes under various reliability and/or use conditions, and are not intended to be used for detailed reliability analysis.
These calculators are based on accepted industry and JEDEC (e.g. JEP122G, JESD47) formulas as noted. TI does not certify or guarantee the accuracy of any calculation result, and TI does not provide any data for calculator input.
Acceptance sample size
Determine the optimal sample size for quality testing by inputting your target DPPM (defective parts per million) confidence level (typically 60%), and expected number of failures.
AFR FIT for lognormal distribution
Get precise Average Failure Rate (AFR) Failures in Time (FIT) calculations for semiconductor reliability analysis. Input your shape and scale parameters along with time ranges to determine failure rates for mechanisms like corrosion, electromigration and defect-related failures.
AFR FIT for Weibull
Calculate failure rates for "weakest link" failure mechanisms like Time Dependent Dielectric Breakdown (TDDB), solder joint thermal fatigue, and mechanical failures using Weibull distribution modeling.
DPPM sample size
Calculate defective parts per million (DPPM) from your sample size, number of failures, and Chi-square confidence level (typically 60%) to determine quality performance.
Fail fraction & AFR FIT
Calculate FIT rates and average failure rates (AFR) by inputting your sample data: number of units tested, operating hours, and observed failures to determine expected long-term reliability performance.
Temperature change FIT
Estimate how temperature changes affect failure rates by inputting qualification temperature, application temperature, and baseline FIT data using Arrhenius equation modeling.
Example: If you have a FIT of 16.7 at a reference temperature of 55C, you can predict FIT at application temperature of 75C to be 69.2 with 0.7Ea
Important Limitations on Use of Data
TI provides this data for your convenience. However, there are significant limitations of its usefulness as an indicator of how TI parts (including related software) may perform when used in various applications.
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TI parts are specifically designed and manufactured to be used within the electrical, thermal, mechanical and other parameters set forth in TI's product data sheets. Quality and reliability data provided by TI, such as MTBF and fit rate data, is intended to facilitate an estimate of the part’s performance to spec, based solely on the part’s historical observations. It should not be interpreted that any performance levels reflected in such data can be met if the part is operated outside appropriate conditions or the conditions described. Also, the accuracy of any projection is subject to many factors outside TI’s control or knowledge. Users should carefully assess predictive value in light of additional factors as appropriate.
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