Aerospace & defense – Products
TI offers multiple enhanced reliability levels to meet your system needs. With a vast selection of data converters, power components, digital signal processors, logic, op amps, memory, clocking and interface offerings, TI can help accelerate your design journey.
Find products that meet industrial, automotive, space and harsh environment qualifications. Browse the classification table for more details on TI’s wide range of reliability ratings for semiconductors. Additional details on high reliability-rated solutions are also available in the document below.
* EP parts are not all available in -55oC to +125oC but most devices do support this range. All QMLQ, QMLV products are required to support this temperature range.
|Tailored for high-volume commercial applications and flexible supply.||High reliability for automotive applications with flexible supply. Packages can use matte Sn and Cu bond wires.||Plastic-packaged parts built with enhanced material sets for harsh environments, controlled by Defense Logistics Agency Vendor Item Drawings (VIDs).||Ceramic military grade parts released to a MIL spec. Intended for extreme environments and long term dormant storage.||Enhanced plastic parts characterized for total dose and single event radiation performance designed for LEO short lifetime missions.||Space grade parts release to a MIL spec. Meant for long lifetime, high reliability missions.||Same as QMLV but additional lot testing and screening for TID (Radiation Assured).|
|Single controlled baseline|
|Can pure tin (Sn) be used?|
|Typical temperature range||-40oC-85oC||-40oC-125oC||-55oC-125oC *||-55oC-125oC||-55oC-125oC||-55oC-125oC||-55oC-125oC|
|Extra qualification & process monitors||None||X-ray & reflow, outlier control||Extended HAST, x-ray & reflow, outlier||MIL-PRF-38535 Group A, B, C, D||Group E, temp cycle, CSAM/TSAM, x-ray & reflow, extended HAST, outlier control||MIL-PRF-38535 Group A, B, C, D||MIL-PRF-38535 Group A, B, C, D, E|
|Life test per wafer lot|