SBAS747C May   2016  – December 2016 ADC32RF45

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 AC Performance Characteristics
    7. 6.7 Digital Requirements
    8. 6.8 Timing Requirements
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Input Clock Diagram
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Analog Inputs
        1. 8.3.1.1 Input Clamp Circuit
      2. 8.3.2  Clock Input
      3. 8.3.3  SYSREF Input
        1. 8.3.3.1 Using SYSREF
        2. 8.3.3.2 Frequency of the SYSREF Signal
      4. 8.3.4  DDC Block
        1. 8.3.4.1 Operating Mode: Receiver
        2. 8.3.4.2 Operating Mode: Wide-Bandwidth Observation Receiver
        3. 8.3.4.3 Decimation Filters
          1. 8.3.4.3.1  Divide-by-4
          2. 8.3.4.3.2  Divide-by-6
          3. 8.3.4.3.3  Divide-by-8
          4. 8.3.4.3.4  Divide-by-9
          5. 8.3.4.3.5  Divide-by-10
          6. 8.3.4.3.6  Divide-by-12
          7. 8.3.4.3.7  Divide-by-16
          8. 8.3.4.3.8  Divide-by-18
          9. 8.3.4.3.9  Divide-by-20
          10. 8.3.4.3.10 Divide-by-24
          11. 8.3.4.3.11 Divide-by-32
          12. 8.3.4.3.12 Latency with Decimation Options
        4. 8.3.4.4 Digital Multiplexer (MUX)
        5. 8.3.4.5 Numerically-Controlled Oscillators (NCOs) and Mixers
      5. 8.3.5  NCO Switching
      6. 8.3.6  SerDes Transmitter Interface
      7. 8.3.7  Eye Diagrams
      8. 8.3.8  Alarm Outputs: Power Detectors for AGC Support
        1. 8.3.8.1 Absolute Peak Power Detector
        2. 8.3.8.2 Crossing Detector
        3. 8.3.8.3 RMS Power Detector
        4. 8.3.8.4 GPIO AGC MUX
      9. 8.3.9  Power-Down Mode
      10. 8.3.10 ADC Test Pattern
        1. 8.3.10.1 Digital Block
        2. 8.3.10.2 Transport Layer
        3. 8.3.10.3 Link Layer
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Configuration
      2. 8.4.2 JESD204B Interface
        1. 8.4.2.1 JESD204B Initial Lane Alignment (ILA)
        2. 8.4.2.2 JESD204B Frame Assembly
        3. 8.4.2.3 JESD204B Frame Assembly in Bypass Mode
        4. 8.4.2.4 JESD204B Frame Assembly with Decimation (Single-Band DDC): Complex Output
        5. 8.4.2.5 JESD204B Frame Assembly with Decimation (Single-Band DDC): Real Output
        6. 8.4.2.6 JESD204B Frame Assembly with Decimation (Single-Band DDC): Real Output
        7. 8.4.2.7 JESD204B Frame Assembly with Decimation (Dual-Band DDC): Complex Output
        8. 8.4.2.8 JESD204B Frame Assembly with Decimation (Dual-Band DDC): Real Output
      3. 8.4.3 Serial Interface
        1. 8.4.3.1 Serial Register Write: Analog Bank
        2. 8.4.3.2 Serial Register Readout: Analog Bank
        3. 8.4.3.3 Serial Register Write: Digital Bank
        4. 8.4.3.4 Serial Register Readout: Digital Bank
        5. 8.4.3.5 Serial Register Write: Decimation Filter and Power Detector Pages
    5. 8.5 Register Maps
      1. 8.5.1  Example Register Writes
      2. 8.5.2  Register Descriptions
        1. 8.5.2.1 General Registers
          1. 8.5.2.1.1 Register 000h (address = 000h), General Registers
          2. 8.5.2.1.2 Register 002h (address = 002h), General Registers
          3. 8.5.2.1.3 Register 003h (address = 003h), General Registers
          4. 8.5.2.1.4 Register 004h (address = 004h), General Registers
          5. 8.5.2.1.5 Register 010h (address = 010h), General Registers
          6. 8.5.2.1.6 Register 011h (address = 011h), General Registers
          7. 8.5.2.1.7 Register 012h (address = 012h), General Registers
      3. 8.5.3  Master Page (M = 0)
        1. 8.5.3.1 Register 020h (address = 020h), Master Page
        2. 8.5.3.2 Register 032h (address = 032h), Master Page
        3. 8.5.3.3 Register 039h (address = 039h), Master Page
        4. 8.5.3.4 Register 03Ch (address = 03Ch), Master Page
        5. 8.5.3.5 Register 05Ah (address = 05Ah), Master Page
        6. 8.5.3.6 Register 03Dh (address = 3Dh), Master Page
        7. 8.5.3.7 Register 057h (address = 057h), Master Page
        8. 8.5.3.8 Register 058h (address = 058h), Master Page
      4. 8.5.4  ADC Page (FFh, M = 0)
        1. 8.5.4.1 Register 03Fh (address = 03Fh), ADC Page
        2. 8.5.4.2 Register 042h (address = 042h), ADC Page
      5. 8.5.5  Digital Function Page (610000h, M = 1 for Channel A and 610100h, M = 1 for Channel B)
        1. 8.5.5.1 Register A6h (address = 0A6h), Digital Function Page
      6. 8.5.6  Offset Corr Page Channel A (610000h, M = 1)
        1. 8.5.6.1 Register 034h (address = 034h), Offset Corr Page Channel A
        2. 8.5.6.2 Register 068h (address = 068h), Offset Corr Page Channel A
      7. 8.5.7  Offset Corr Page Channel B (610000h, M = 1)
        1. 8.5.7.1 Register 068h (address = 068h), Offset Corr Page Channel B
      8. 8.5.8  Digital Gain Page (610005h, M = 1 for Channel A and 610105h, M = 1 for Channel B)
        1. 8.5.8.1 Register 0A6h (address = 0A6h), Digital Gain Page
      9. 8.5.9  Main Digital Page Channel A (680000h, M = 1)
        1. 8.5.9.1 Register 000h (address = 000h), Main Digital Page Channel A
        2. 8.5.9.2 Register 0A2h (address = 0A2h), Main Digital Page Channel A
      10. 8.5.10 Main Digital Page Channel B (680001h, M = 1)
        1. 8.5.10.1 Register 000h (address = 000h), Main Digital Page Channel B
        2. 8.5.10.2 Register 0A2h (address = 0A2h), Main Digital Page Channel B
      11. 8.5.11 JESD Digital Page (6900h, M = 1)
        1. 8.5.11.1  Register 001h (address = 001h), JESD Digital Page
        2. 8.5.11.2  Register 002h (address = 002h ), JESD Digital Page
        3. 8.5.11.3  Register 003h (address = 003h), JESD Digital Page
        4. 8.5.11.4  Register 004h (address = 004h), JESD Digital Page
        5. 8.5.11.5  Register 006h (address = 006h), JESD Digital Page
        6. 8.5.11.6  Register 007h (address = 007h), JESD Digital Page
        7. 8.5.11.7  Register 016h (address = 016h), JESD Digital Page
        8. 8.5.11.8  Register 017h (address = 017h), JESD Digital Page
        9. 8.5.11.9  Register 032h-035h (address = 032h-035h), JESD Digital Page
        10. 8.5.11.10 Register 036h (address = 036h), JESD Digital Page
        11. 8.5.11.11 Register 037h (address = 037h), JESD Digital Page
        12. 8.5.11.12 Register 03Eh (address = 03Eh), JESD Digital Page
      12. 8.5.12 Decimation Filter Page
        1. 8.5.12.1  Register 000h (address = 000h), Decimation Filter Page
        2. 8.5.12.2  Register 001h (address = 001h), Decimation Filter Page
        3. 8.5.12.3  Register 002h (address = 2h), Decimation Filter Page
        4. 8.5.12.4  Register 005h (address = 005h), Decimation Filter Page
        5. 8.5.12.5  Register 006h (address = 006h), Decimation Filter Page
        6. 8.5.12.6  Register 007h (address = 007h), Decimation Filter Page
        7. 8.5.12.7  Register 008h (address = 008h), Decimation Filter Page
        8. 8.5.12.8  Register 009h (address = 009h), Decimation Filter Page
        9. 8.5.12.9  Register 00Ah (address = 00Ah), Decimation Filter Page
        10. 8.5.12.10 Register 00Bh (address = 00Bh), Decimation Filter Page
        11. 8.5.12.11 Register 00Ch (address = 00Ch), Decimation Filter Page
        12. 8.5.12.12 Register 00Dh (address = 00Dh), Decimation Filter Page
        13. 8.5.12.13 Register 00Eh (address = 00Eh), Decimation Filter Page
        14. 8.5.12.14 Register 00Fh (address = 00Fh), Decimation Filter Page
        15. 8.5.12.15 Register 010h (address = 010h), Decimation Filter Page
        16. 8.5.12.16 Register 011h (address = 011h), Decimation Filter Page
        17. 8.5.12.17 Register 014h (address = 014h), Decimation Filter Page
        18. 8.5.12.18 Register 016h (address = 016h), Decimation Filter Page
        19. 8.5.12.19 Register 01Eh (address = 01Eh), Decimation Filter Page
        20. 8.5.12.20 Register 01Fh (address = 01Fh), Decimation Filter Page
        21. 8.5.12.21 Register 033h-036h (address = 033h-036h), Decimation Filter Page
        22. 8.5.12.22 Register 037h (address = 037h), Decimation Filter Page
        23. 8.5.12.23 Register 03Ah (address = 03Ah), Decimation Filter Page
      13. 8.5.13 Power Detector Page
        1. 8.5.13.1  Register 000h (address = 000h), Power Detector Page
        2. 8.5.13.2  Register 001h-002h (address = 001h-002h), Power Detector Page
        3. 8.5.13.3  Register 003h (address = 003h), Power Detector Page
        4. 8.5.13.4  Register 007h-00Ah (address = 007h-00Ah), Power Detector Page
        5. 8.5.13.5  Register 00Bh-00Ch (address = 00Bh-00Ch), Power Detector Page
        6. 8.5.13.6  Register 00Dh (address = 00Dh), Power Detector Page
        7. 8.5.13.7  Register 00Eh (address = 00Eh), Power Detector Page
        8. 8.5.13.8  Register 00Fh, 010h-012h, and 016h-019h (address = 00Fh, 010h-012h, and 016h-019h), Power Detector Page
        9. 8.5.13.9  Register 013h-01Ah (address = 013h-01Ah), Power Detector Page
        10. 8.5.13.10 Register 01Dh-01Eh (address = 01Dh-01Eh), Power Detector Page
        11. 8.5.13.11 Register 020h (address = 020h), Power Detector Page
        12. 8.5.13.12 Register 021h (address = 021h), Power Detector Page
        13. 8.5.13.13 Register 022h-025h (address = 022h-025h), Power Detector Page
        14. 8.5.13.14 Register 027h (address = 027h), Power Detector Page
        15. 8.5.13.15 Register 02Bh (address = 02Bh), Power Detector Page
        16. 8.5.13.16 Register 032h-035h (address = 032h-035h), Power Detector Page
        17. 8.5.13.17 Register 037h (address = 037h), Power Detector Page
        18. 8.5.13.18 Register 038h (address = 038h), Power Detector Page
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Start-Up Sequence
      2. 9.1.2 Hardware Reset
      3. 9.1.3 SNR and Clock Jitter
        1. 9.1.3.1 External Clock Phase Noise Consideration
      4. 9.1.4 Power Consumption in Different Modes
      5. 9.1.5 Using DC Coupling in the ADC32RF45
        1. 9.1.5.1 Bypassing the Offset Corrector Block
          1. 9.1.5.1.1 Effect of Temperature
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Transformer-Coupled Circuits
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

Application Information

Start-Up Sequence

The steps in Table 115 are recommended as the power-up sequence when the ADC32RF45 is in bypass mode with a 12-bit output (LMFS = 82820).

Table 115. Initialization Sequence

STEP DESCRIPTION PAGE, REGISTER ADDRESS AND DATA COMMENT
1 Supply all supply voltages. There is no required power-supply sequence for the 1.15 V, 1.2 V, and 1.9 V supplies, and can be supplied in any order.
2 Provide the SYSREF signal.
3 Pulse a hardware reset (low-to-high-to-low) on pins 33 and 34.
4 Write the register addresses described in the PowerUpConfig file. See the files located in SBAA226 The Power-up config file contains analog trim registers that are required for best performance of the ADC. Write these registers every time after power up.
5 Write the register addresses mentioned in the ILConfigNyqX_ChA file, where X is the Nyquist zone. See the files located in SBAA226 Based on the signal band of interest, provide the Nyquist zone information to the device.
6 Write the register addresses mentioned in the ILConfigNyqX_ChB file, where X is the Nyquist zone. See the files located in SBAA226 This step optimizes device’ performance by reducing interleaving mismatch errors.
6.1 Wait for 50 ms for the device to estimate the interleaving errors.
7 Depending upon the Nyquist band of operation, choose and write the registers from the appropriate file, NLConfigNyqX_ChA, where X is the Nyquist zone. See the files located in SBAA226 Third-order nonlinearity of the device is optimized by this step for channel A.
7.1 Depending upon the Nyquist band of operation, choose and write the registers from the appropriate file, NLConfigNyqX_ChB, where X is the Nyquist zone. See the files located in SBAA226 Third-order nonlinearity of the device is optimized by this step for channel B.
8 Configure the JESD interface and DDC block by writing the registers mentioned in the DDC Config file. See the files located in SBAA226 Determine the DDC and JESD interface LMFS options. Program these options in this step.

Hardware Reset

Timing information for the hardware reset is shown in Figure 230 and Table 116.

ADC32RF45 hardware_reset_sbas747.gif Figure 230. Hardware Reset Timing Diagram

Table 116. Hardware Reset Timing Information

MIN TYP MAX UNIT
t1 Power-on delay from power-up to active high RESET pulse 1 ms
t2 Reset pulse duration: active high RESET pulse duration 1 µs
t3 Register write delay from RESET disable to SEN active 100 ns

SNR and Clock Jitter

The signal-to-noise ratio (SNR) of the ADC is limited by three different factors: quantization noise, thermal noise, and jitter, as shown in Equation 5. The quantization noise is typically not noticeable in pipeline converters and is 84 dB for a 14-bit ADC. The thermal noise limits the SNR at low input frequencies and the clock jitter sets the SNR for higher input frequencies.

Equation 5. ADC32RF45 snr_adc_eq_sbas747.gif

The SNR limitation resulting from sample clock jitter can be calculated by Equation 6:

Equation 6. ADC32RF45 snr_jitter_eq_sbas747.gif

The total clock jitter (TJitter) has two components: the internal aperture jitter (90 fS) is set by the noise of the clock input buffer and the external clock jitter. TJitter can be calculated by Equation 7:

Equation 7. ADC32RF45 total_clck_jitter_sbas747.gif

External clock jitter can be minimized by using high-quality clock sources and jitter cleaners as well as band-pass filters at the clock input. A faster clock slew rate also improves the ADC aperture jitter.

The ADC32RF45 has a thermal noise of approximately 63 dBFS and an internal aperture jitter of 90 fS. The SNR, depending on the amount of external jitter for different input frequencies, is shown in Figure 231.

ADC32RF45 D048_ADC32RF45.gif Figure 231. ADC SNR vs Input Frequency and External Clock Jitter

External Clock Phase Noise Consideration

External clock jitter can be calculated by integrating the phase noise of the clock source out to approximately two times of the ADC sampling rate (2 × fS), as shown in Figure 232. In order to maximize the ADC SNR, an external band-pass filter is recommended to be used on the clock input. This filter reduces the jitter contribution from the broadband clock phase noise floor by effectively reducing the integration bandwidth to the pass band of the band-pass filter. This method is suitable when estimating the overall ADC SNR resulting from clock jitter at a certain input frequency.

ADC32RF45 adc_snr_sbas747.gif Figure 232. Integration Bandwidth for Extracting Jitter from Clock Phase Noise

However, when estimating the affect of a nearby blocker (such as a strong in-band interferer to the sensitivity, the phase noise information can be used directly to estimate the noise budget contribution at a certain offset frequency, as shown in Figure 233.

ADC32RF45 phase_noise_info_sbas747.gif Figure 233. Small Wanted Signal in Presence of Interferer

At the sampling instant, the phase noise profile of the clock source convolves with the input signal (for example, the small wanted signal and the strong interferer merge together). If the power of the clock phase noise in the signal band of interest is too large, the wanted signal cannot not be recovered.

The resulting equivalent phase noise at the ADC input is also dependent on the sampling rate of the ADC and frequency of the input signal. The ADC sampling rate scales the clock phase noise, as shown in Equation 8.

Equation 8. ADC32RF45 adc_nsd_eq_sbas747.gif

Using this information, the noise contribution resulting from the phase noise profile of the ADC sampling clock can be calculated.

Power Consumption in Different Modes

The ADC32RF45 consumes approximately 6.6 W of power when both channels are active with a 12-bit, 3-GSPS output and a DDC option is not used (bypass mode). When different DDC options are used, the power consumption on the DVDD supply changes by a small amount but remains unaffected on other supplies. In the applications requiring just one channel to be active, channel A must be chosen as the active channel and channel B can be powered down. Power consumption reduces to approximately 4 W in single-channel operation with a 12-bit, 3-GSPS output (bypass mode).

Table 117 shows power consumption in different DDC modes for dual-channel and single-channel operation.

Table 117. Power Consumption in Different DDC Modes (Sampling Clock Frequency, fS = 3 GSPS)

DECIMATION OPTION ACTIVE
CHANNEL
ACTIVE DDC AVDD19 (mA) AVDD (mA) DVDD (mA) TOTAL POWER (mW)
Bypass mode Channels A, B NA 1792 972 1748 6533
Divide-by-4 Channels A, B Single 1777 970 1785 6545
Divide-by-8 Channels A, B Dual 1777 973 1960 6749
Divide-by-8 Channels A, B Single 1777 973 1730 6485
Divide-by-16 Channels A, B Dual 1777 972 1971 6761
Divide-by-16 Channels A, B Single 1777 972 1705 6455
Divide-by-24 Channels A, B Dual 1771 975 1938 6715
Divide-by-24 Channels A, B Single 1771 972 1667 6400
Divide-by-32 Channels A, B Dual 1768 972 1835 6587
Divide-by-32 Channels A, B Single 1768 970 1574 6285
Bypass mode Channel A NA 968 793 1133 4054
Divide-by-4 Channel A Single 961 796 1096 4002
Divide-by-8 Channel A Dual 961 790 1168 4078
Divide-by-8 Channel A Single 961 786 1047 3934
Divide-by-16 Channel A Dual 961 789 1172 4081
Divide-by-16 Channel A Single 961 786 1045 3932
Divide-by-24 Channel A Dual 958 785 1155 4051
Divide-by-24 Channel A Single 958 787 1016 3894
Divide-by-32 Channel A Dual 956 788 1104 3992
Divide-by-32 Channel A Single 956 786 978 3845

Using DC Coupling in the ADC32RF45

The ADC32RF45 can be used in dc-coupling applications. However, the following points must be considered when designing the system:

  1. Ensure that the correct common-mode voltage is used at the ADC analog inputs.
  2. The analog inputs are internally self-biased to VCM through approximately a 33-Ω resistor. The internal biasing resistors also function as a termination resistor. However, if a different termination is required, the external resistor RTERM can be differentially placed between the analog inputs, as shown in Figure 234. The amplifier VOCM pin is recommended to be driven from the CM pin of the ADC to help the amplifier output common-mode voltage track the required common-mode voltage of the ADC.

    ADC32RF45 dc_coupling_app_sbas747.gif
    Set the INCR CM IMPEDANCE bit to increase the RCM from 0 Ω to > 5000 Ω.
    RDC is approximately 65 Ω.
    Figure 234. The ADC32RF45 in a DC-Coupling Application
  3. Ensure that the correct SPI settings are written to the ADC.
  4. As shown in Figure 235, the ADC32RF45 has a digital block that estimates and corrects the offset mismatch among four interleaving ADC cores for a given channel.

    ADC32RF45 offset_corr_lck_sbas747.gif Figure 235. Offset Corrector in the ADC32RF45

    The offset corrector block nullifies dc, fS / 8, fS / 4, 3 fS / 8, and fS / 2. The resulting spectrum becomes free from static spurs at these frequencies. The corrector continuously processes the data coming from the interleaving ADC cores and cannot distinguish if the tone at these frequencies is part of signal or if the tone originated from a mismatch among the interleaving ADC cores. Thus, in applications where the signal is present at these frequencies, the offset corrector block can be bypassed.

Bypassing the Offset Corrector Block

When the offset corrector is bypassed, offset mismatch among interleaving ADC cores appears in the ADC output spectrum. To correct the effects of mismatch, place the ADC in an idle channel state (no signal at the ADC inputs) and the corrector must be allowed to run for some time to estimate the mismatch, then the corrector is frozen so that the last estimated value is held. Required register writes are provided in Table 118.

Table 118. Freezing and Bypassing the Offset Corrector Block

STEP REGISTER WRITE COMMENT
STEPS FOR FREEZING THE CORRECTOR BLOCK
1 Signal source is turned off. The device detects an idle channel at its input.
2 Wait for at least 0.4 ms for the corrector to estimate the internal offset
3 Address 4001h, value 00h Select Offset Corr Page Channel A
Address 4002h, value 00h
Address 4003h, value 00h
Address 4004h, value 61h
Address 6068h, value C2h Freeze the corrector for channel A
Address 4003h, value 01h Select Offset Corr Page Channel B
Address 6068h, value C2h Freeze the corrector for channel B
4 Signal source can now be turned on
STEPS FOR BYPASSING THE CORRECTOR BLOCK
1 Address 4001h, value 00h
Address 4002h, value 00h
Address 4003h, value 00h
Address 4004h, value 61h Select Offset Corr Page Channel A
Address 6068h, value 46h Disable the corrector for channel A
Address 4003h, value 01h Select Offset Corr Page Channel B
Address 6068h, value 46h Disable the corrector for channel B

Effect of Temperature

Figure 236 and Figure 237 show the behavior of nfS / 8 tones with respect to temperature when the offset corrector block is frozen or disabled.

ADC32RF45 D058_SBAS747.gif Figure 236. Offset Corrector Block Frozen at Room Temperature
ADC32RF45 D060_SBAS747.gif Figure 237. Offset Corrector Block Disabled

Typical Application

The ADC32RF45 is designed for wideband receiver applications demanding high dynamic range over a large input frequency range. A typical schematic for an ac-coupled receiver is shown in Figure 238.

Decoupling capacitors with low ESL are recommended to be placed as close as possible at the pins indicated in Figure 238. Additional capacitors can be placed on the remaining power pins.

ADC32RF45 ac_cpld_rcvr_sbas747.gif Figure 238. Typical Application Implementation Diagram

Design Requirements

Transformer-Coupled Circuits

Typical applications involving transformer-coupled circuits are discussed in this section. To ensure good amplitude and phase balance at the analog inputs, transformers (such as TC1-1-13 and TC1-1-43) can be used from the dc to 1000-MHz range and from the 1000-MHz to 4-GHz range of input frequencies, respectively. When designing the driving circuits, the ADC input impedance (or SDD11) must be considered.

By using the simple drive circuit of Figure 239, uniform performance can be obtained over a wide frequency range. The buffers present at the analog inputs of the device help isolate the external drive source from the switching currents of the sampling circuit.

ADC32RF45 ai_input_drive_cir_sbas747.gif Figure 239. Input Drive Circuit

Detailed Design Procedure

For optimum performance, the analog inputs must be driven differentially. This architecture improves common-mode noise immunity and even-order harmonic rejection. A small resistor (5 Ω to 10 Ω) in series with each input pin is recommended to damp out ringing caused by package parasitics, as shown in Figure 239.

Application Curves

Figure 240 and Figure 241 show the typical performance at 100 MHz and 1780 MHz, respectively.

ADC32RF45 D001_SBAS747.gif
SNR = 61.8 dBFS, SINAD = 61.2 dBFS,
HD2 = 71 dBc, HD3 = 75 dBc, SFDR = 71 dBc,
THD = 68 dBc, IL spur = 77 dBc, worst spur = 73 dBc
Figure 240. FFT for 100-MHz Input Frequency
ADC32RF45 D003_SBAS747.gif
SNR = 57.9 dBFS, SINAD = 57.1 dBFS,
HD2 = 63 dBc, HD3 = 66 dBc, SFDR = 63 dBc,
THD = 60 dBc, IL spur = 79 dBc, worst spur = 77 dBc
Figure 241. FFT for 1780-MHz Input Frequency