SLOS912D February   2015  – July 2015 ALM2402-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Thermal Information
    3. 7.3 ESD Ratings
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Electrical Characteristics
    6. 7.6 AC Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 OTF/SH_DN
      2. 8.3.2 Supply Voltage
      3. 8.3.3 Current Limit and Short Circuit Protection
      4. 8.3.4 Input Common Mode Range and Overvoltage Clamps
      5. 8.3.5 Thermal Shutdown
      6. 8.3.6 Output Stage
      7. 8.3.7 EMI Susceptibility and Input Filtering
    4. 8.4 Device Functional Modes
      1. 8.4.1 Open Loop and Closed Loop
      2. 8.4.2 Shutdown
  9. 9 Applications and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Capacitive Load and Stability
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Resolver Excitation Input (Opamp Output)
          1. 9.2.2.1.1 Excitation Voltage
          2. 9.2.2.1.2 Excitation Frequency
          3. 9.2.2.1.3 Excitation Impedance
        2. 9.2.2.2 Resolver Output
        3. 9.2.2.3 Power Dissipation and Thermal Reliability
          1. 9.2.2.3.1 Improving Package Thermal Performance
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Revision History

Changes from C Revision (June 2015) to D Revision

  • Added package corresponding to ESD levelGo
  • Removed HTSSOP preview statusGo
  • Added thermal metrics for PWP Go
  • Added CDM value for PWP Go

Changes from B Revision (May 2015) to C Revision

  • Changed DRR to industry standard SON. Go
  • Changed document wording to remove the word "guarantee." Go
  • Updated Resolver Application Graphic. Go

Changes from A Revision (April 2015) to B Revision

  • Fixed HBM Classification typo from "Level 2" to "Level H2"Go

Changes from * Revision (February 2015) to A Revision

  • Initial release of full version document.Go