SLLS103P December   1990  – March 2024 AM26C31

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics: AM26C31C and AM26C31I
    6. 5.6 Electrical Characteristics: AM26C31Q and AM26C31M
    7. 5.7 Switching Characteristics: AM26C31C and AM26C31I
    8. 5.8 Switching Characteristics: AM26C31Q and AM26C31M
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Active-High and Active-Low
      2. 7.3.2 Operates From a Single 5V Supply
    4. 7.4 Device Functional Modes
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)AM26C31UNIT
D
(SOIC)		DB
(SSOP)		PW
(TSSOP)		NS
(SO)		N
(PDIP)		J
(CDIP)		W
(CFP)		FK
(LCCC)
16 PINS16 PINS16 PINS16 PINS16 PINS16 PINS16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance(2)(3)84.6102.6107.588.560.6———°C/W
RθJC(top)Junction-to-case (top) thermal resistance43.548.738.446.248.139.3(4)58.9(4)37.1(4)°C/W
RθJBJunction-to-board thermal resistance43.254.353.750.740.656.4(4)109.3(4)36.2(4)°C/W
ψJTJunction-to-top characterization parameter10.411.83.213.527.5———°C/W
ψJBJunction-to-board characterization parameter42.853.553.150.340.3———°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistancen/an/an/an/an/a12(4)5.7(4)4.3(4)°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA) / RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(4) Modelling assumption: MIL-STD-883 for RθJC(top) and RθJC(bot) JESD51 for RθJB.