Refer to the PDF data sheet for device specific package drawings
Failure to maintain a junction temperature within the range specified in Section 5.5 reduces operating lifetime, reliability, and performance—and may cause irreversible damage to the system. Therefore, the product design cycle should include thermal analysis to verify the maximum operating junction temperature of the device. It is important this thermal analysis is performed using specific system use cases and conditions. TI provides an application report to aid users in overcoming some of the existing challenges of producing a good thermal design. For more information, see AM335x Thermal Considerations.
Table 5-12 provides thermal characteristics for the packages used on this device.
Table 5-12 provides simulation data and may not represent actual use-case values.
|ZCE (°C/W)(1)(2)||ZCZ (°C/W)(1)(2)||AIR FLOW (m/s)(3)|