SBOS559B May   2011  – October 2015 AMC80

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Block Level Description
      2. 7.3.2 Temperature Measurement
        1. 7.3.2.1 Default Interrupt Mode
        2. 7.3.2.2 One-Time Interrupt Mode
        3. 7.3.2.3 Comparator Mode
      3. 7.3.3 Interrupt Structure
    4. 7.4 Programming
      1. 7.4.1 Interface and Control
    5. 7.5 Register Map
      1. 7.5.1  Configuration Register
      2. 7.5.2  Interrupt Status Registers
      3. 7.5.3  Interrupt Mask Registers
      4. 7.5.4  Fan Divisor/RST_OUT/OS Register
      5. 7.5.5  OS Configuration/Temperature Resolution Register
      6. 7.5.6  Conversion Rate Register
      7. 7.5.7  Voltage/Temperature Channel Disable Register
      8. 7.5.8  Input Mode Register
      9. 7.5.9  ADC Control Register
      10. 7.5.10 Conversion Rate Count Register
      11. 7.5.11 Value Ram Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Power-On
      2. 8.1.2 Analog Inputs
      3. 8.1.3 Fan Inputs
  9. 9 Device and Documentation Support
    1. 9.1 Community Resources
    2. 9.2 Trademarks
    3. 9.3 Electrostatic Discharge Caution
    4. 9.4 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)

Over operating free-air temperature range, unless otherwise noted.
MIN MAX UNIT
Power-supply voltage range, V+ –0.3 7 V
Input voltage range, VIN Pins 6, 10, 15, 16, 17, 18, 19, 20, 21, 22, 24 –0.3 (V+) + 0.3 V
Pins 1, 2, 3, 4, 5, 7, 9, 11, 12, 13, 23 –0.3 7
Input current, IIN 10 mA
Operating temperature range, TA –55 127 °C
Junction temperature range, TJ max 150 °C
Storage temperature range, TSTG –65 150 °C
(1) Stresses above these ratings my cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
Machine model (MM) ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. ance.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
Supply voltage range, V+ 3 5.5 V
Input voltage range, VIN –0.05 (V+) + 0.05 V
Operating temperature range, TA –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) AMC80 UNIT
PW (TSSOP)
24 PINS
RθJA Junction-to-ambient thermal resistance 100.72 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 31.4 °C/W
RθJB Junction-to-board thermal resistance 54.7 °C/W
ψJT Junction-to-top characterization parameter 1.0 °C/W
ψJB Junction-to-board characterization parameter 54.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

At TA –40°C to +125°C and V+ = 3 V to 5.5 V, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DIGITAL INPUTS
VIH Input high voltage 2 V
VIL Input low voltage 0.8 V
VHYS Hysteresis voltage V+ = 3.3 V 0.23 V
V+ = 5 V 0.33 V
IIH Input high current VIH = V+, all pins except BTI –1 –0.005 µA
VIH = V+, BTI pin –10 –1 µA
IIL Input low current VIL = 0 V, all pins except BTI 0.005 1 µA
VIL = 0 V, V+ = 5.5 V, BTI pin 2 mA
CIN Input capacitance 20 pF
ANALOG INPUTS
VIN Input voltage range Default 0 2.56 V
Programmable 0 V+ V
IL-ON Input leakage current (on) ±0.005 µA
IL-OFF Input leakage current (off) ±0.005 µA
RIN Input resistance 2 10 kΩ
DIGITAL OUTPUTS (A0/NTEST_OUT, INT)
VOH Output high voltage IOUT = 3 mA/5 mA, V+ = 3 V/4.5 V 2.4 V
VOL Output low voltage IOUT = 3 mA/5 mA, V+ = 3 V/4.5 V 0.4 V
DIGITAL OPEN-DRAIN OUTPUTS (GPO, RST_OUT/OS, GPI/CI, SDA)
VOL Output low voltage IOUT = 3 mA/5 mA, V+ = 3 V/4.5 V,
all pins except SDA		 0.4 V
IOUT = 4 mA, V+ = 3 V, SDA pin 0.4
IOH Output high current VOUT = V+ 0.005 1 µA
tw Pulse duration RST_OUT/OS, GPI/CI 10 22.5 ms
SMBus
SMBus timeout(1) 28 35 ms
TEMPERATURE ERROR
TE Temperature error TA = –40°C to +125°C ±3 °C
TA = –25°C to +100°C ±2 °C
TR Temperature resolution 0.0625 °C
ANALOG-TO-DIGITAL CONVERTER
VR Resolution VIN = 2.56 V 2.5 mV
VIN = V+ 6
DNL Differential linearity –1 1 LSB(2)
ADCERR Total unadjusted error(3) –1% 1%
PSRR Power supply rejection ratio ±0.0008%
tC(4) Total conversion time 662 728 810 ms
FAN RPM-TO-DIGITAL CONVERTER
FANERR Fan RPM error –10% 10%
fCLK Internal clock frequency 20.2 22.5 24.8 kHz
FANRPM FAN1 and FAN2 nominal input RPM Divisor = 1, fan count = 153 8800 RPM
Divisor = 2, fan count = 153 4400
Divisor = 3, fan count = 153 2200
Divisor = 4, fan count = 153 1100
FSC Full-scale count 255 Counts
POWER SUPPLY
V+ Specified voltage range 3 5.5 V
IQA Quiescent current, average V+ = 5.5 V 100 µA
V+ = 3.8 V 25
IQSD Quiescent current, shutdown mode V+ = 5.5 V 100 µA
V+ = 3.8 V 25
TEMPERATURE
TA Specified range -40 125 °C
(1) The SMBus timeout in the AMC80 resets the interface anytime SCL or SDA is low for over 28 ms.
(2) LSB means least significant bit.
(3) Total unadjusted error contains offset, gain, and linearity errors of the ADC.
(4) Total conversion time contains the temperature conversion, the seven analog input voltage conversions, and the two tachometer readings.

6.6 Timing Requirements

At TA –40°C to +125°C and VS = 3V to 5.5V, unless otherwise noted.
FAST MODE(1) HIGH-SPEED MODE(1) UNIT
MIN MAX MIN MAX
f(SCL) SCL operating frequency 10 400 10 3400 kHz
t(BUF) Bus free time between STOP and START conditions 600 160 ns
t(HDSTA) Hold time after repeated START condition. After this period, the first clock is generated. 600 160 ns
t(SUSTA) Repeated START condition setup time 600 160 ns
t(SUSTO) STOP condition setup time 600 160 ns
t(HDDAT) Data hold time 0(2) 0(3) ns
t(SUDAT) Data setup time 100 10 ns
t(LOW) Clock low period 1300 160 ns
t(HIGH) Clock high period 600 60 ns
tR Clock/Data input rise time 300 160 ns
tF Clock/Data input fall time 300 160 ns
(1) Values based on a statistical analysis of a one-time sample of devices. Minimum and maximum values are not specified and not production tested.
(2) For cases when the fall time of SCL is less than 20 ns and/or the rise time or fall time of SDA is less than 20 ns, the hold time should be greater than 20 ns.
(3) For cases when the fall time of SCL is less than 10 ns and/or the rise or fall time of SDA is less than 10 ns, the hold time should be greater than 10 ns.
AMC80 tim_two-wire_bos559.gif Figure 1. Serial Bus Interface Timing

6.7 Typical Characteristics

At TA = +25°C and V+ = 3 V to 5.5 V, unless otherwise noted.
AMC80 tc_iqa-v_bos559.gif
Figure 2. Average Quiescent Current vs Supply Voltage
AMC80 tc_iqt-v_bos559.gif
Figure 4. Quiescent Current During Temperature Conversion vs Supply Voltage
AMC80 tc_tmp_error-v_bos559.gif
Figure 6. Temperature Error vs Supply Voltage
AMC80 tc_iqv-v_bos559.gif
Figure 3. Quiescent Current During Voltage Conversion vs Supply Voltage
AMC80 tc_iqsd-v_bos559.gif
Figure 5. Quiescent Current During Shutdown vs Supply Voltage