SLUSCQ5 October   2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
  7. 7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Device Protection Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Power Up
      2. 8.3.2 Battery Switch (Q1 + Q2)
      3. 8.3.3 Integrated 10-bit ADC for Monitoring
      4. 8.3.4 Linear Regulation Mode (LDO)
      5. 8.3.5 Protection Features
        1. 8.3.5.1 Reverse Current Protection (RCP)
        2. 8.3.5.2 Internal Thermal Shutdown
        3. 8.3.5.3 IBUS and VBUS Protection
        4. 8.3.5.4 IBAT and VBAT Protection
        5. 8.3.5.5 VOUT Protection
        6. 8.3.5.6 VDROP Protection
        7. 8.3.5.7 VBUS Temperature (TS_BUS_FLT) and Battery Temperature (TS_BAT_FLT)
      6. 8.3.6 I2C Serial Interface
        1. 8.3.6.1 Data Validity
        2. 8.3.6.2 START and STOP Conditions
        3. 8.3.6.3 Byte Format
        4. 8.3.6.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 8.3.6.5 Slave Address and Data Direction bit
        6. 8.3.6.6 Multi-Read and Multi-Write
    4. 8.4 Device Functional Modes
    5. 8.5 I2C Register Maps
      1. 8.5.1  I2C Register Summary Table
      2. 8.5.2  REG00 (DEVICE_INFO)
      3. 8.5.3  REG01 (EVENT_1_MASK)
      4. 8.5.4  REG02 (EVENT_2_MASK)
      5. 8.5.5  REG03 (EVENT_1)
      6. 8.5.6  REG04 (EVENT_2)
      7. 8.5.7  REG05 (EVENT_1_EN)
      8. 8.5.8  REG06 (CONTROL)
      9. 8.5.9  REG07 (ADC_CONTROL)
      10. 8.5.10 REG08 (ADC_EN)
      11. 8.5.11 REG09 (PROTECTION)
      12. 8.5.12 REG0A (VBUS_OVP)
      13. 8.5.13 REG0B (VOUT_REG)
      14. 8.5.14 REG0C (VDROP_OVP)
      15. 8.5.15 REG0D (VDROP_ALM)
      16. 8.5.16 REG0E (VBAT_REG)
      17. 8.5.17 REG0F (IBAT_REG)
      18. 8.5.18 REG10 (IBUS_REG)
      19. 8.5.19 REG11 (TS_BUS_FLT)
      20. 8.5.20 REG12 (TS_BAT_FLT)
      21. 8.5.21 REG 13 and REG 14 (VBUS_ADC)
      22. 8.5.22 REG15 and REG16 (IBUS_ADC)
      23. 8.5.23 REG17 and REG18 (VOUT_ADC)
      24. 8.5.24 REG19 and REG1A (VDROP_ADC)
      25. 8.5.25 REG1B and REG1C (VBAT_ADC)
      26. 8.5.26 REG1D and REG1E (IBAT_ADC)
      27. 8.5.27 REG1F and REG20 (TS_BUS_ADC)
      28. 8.5.28 REG21 and REG22 (TS_BAT_ADC)
      29. 8.5.29 REG 23 (TDIE_ADC)
      30. 8.5.30 REG 24 (EVENT_2_EN)
      31. 8.5.31 REG 25 (EVENT_3_MASK)
      32. 8.5.32 REG 26 (EVENT_3)
      33. 8.5.33 REG 29 (CONTROL_2)
      34. 8.5.34 REG 40 (DIE_TEMP_FLT)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFF|42
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments.

I2C is a trademark of Philips Semiconductor.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.