SLUSC88C March   2015  – October 2022 BQ25895

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings (1)
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Feature Description
      1. 8.2.1  Device Power-On-Reset (POR)
      2. 8.2.2  Device Power Up from Battery without Input Source
      3. 8.2.3  Device Power Up from Input Source
        1. 8.2.3.1 Power Up REGN Regulation (LDO)
        2. 8.2.3.2 Poor Source Qualification
        3. 8.2.3.3 Input Source Type Detection
          1. 8.2.3.3.1 D+/D– Detection Sets Input Current Limit
          2. 8.2.3.3.2 Force Input Current Limit Detection
        4. 8.2.3.4 Input Voltage Limit Threshold Setting (VINDPM Threshold)
        5. 8.2.3.5 Converter Power-Up
      4. 8.2.4  Input Current Optimizer (ICO)
      5. 8.2.5  Boost Mode Operation from Battery
      6. 8.2.6  Power Path Management
        1. 8.2.6.1 Narrow VDC Architecture
        2. 8.2.6.2 Dynamic Power Management
        3. 8.2.6.3 Supplement Mode
      7. 8.2.7  Battery Charging Management
        1. 8.2.7.1 Autonomous Charging Cycle
        2. 8.2.7.2 Battery Charging Profile
        3. 8.2.7.3 Charging Termination
        4. 8.2.7.4 Resistance Compensation (IRCOMP)
        5. 8.2.7.5 Thermistor Qualification
          1. 8.2.7.5.1 Cold/Hot Temperature Window in Charge Mode
          2. 8.2.7.5.2 Cold/Hot Temperature Window in Boost Mode
        6. 8.2.7.6 Charging Safety Timer
      8. 8.2.8  Battery Monitor
      9. 8.2.9  Status Outputs (STAT, and INT)
        1. 8.2.9.1 Charging Status Indicator (STAT)
        2. 8.2.9.2 Interrupt to Host (INT)
      10. 8.2.10 BATET (Q4) Control
        1. 8.2.10.1 BATFET Disable Mode (Shipping Mode)
        2. 8.2.10.2 BATFET Enable (Exit Shipping Mode)
        3. 8.2.10.3 BATFET Full System Reset
      11. 8.2.11 Current Pulse Control Protocol
      12. 8.2.12 Input Current Limit on ILIM
      13. 8.2.13 Thermal Regulation and Thermal Shutdown
        1. 8.2.13.1 Thermal Protection in Buck Mode
        2. 8.2.13.2 Thermal Protection in Boost Mode
      14. 8.2.14 Voltage and Current Monitoring in Buck and Boost Mode
        1. 8.2.14.1 Voltage and Current Monitoring in Buck Mode
          1. 8.2.14.1.1 Input Overvoltage (ACOV)
          2. 8.2.14.1.2 System Overvoltage Protection (SYSOVP)
        2. 8.2.14.2 Current Monitoring in Boost Mode
          1. 8.2.14.2.1 Boost Mode Overvoltage Protection
      15. 8.2.15 Battery Protection
        1. 8.2.15.1 Battery Overvoltage Protection (BATOVP)
        2. 8.2.15.2 Battery Over-Discharge Protection
        3. 8.2.15.3 System Overcurrent Protection
      16. 8.2.16 Serial Interface
        1. 8.2.16.1 Data Validity
        2. 8.2.16.2 START and STOP Conditions
        3. 8.2.16.3 Byte Format
        4. 8.2.16.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 8.2.16.5 Target Address and Data Direction Bit
        6. 8.2.16.6 Single Read and Write
        7. 8.2.16.7 Multi-Read and Multi-Write
    3. 8.3 Device Functional Modes
      1. 8.3.1 Host Mode and Default Mode
    4. 8.4 Register Maps
      1. 8.4.1  REG00
      2. 8.4.2  REG01
      3. 8.4.3  REG02
      4. 8.4.4  REG03
      5. 8.4.5  REG04
      6. 8.4.6  REG05
      7. 8.4.7  REG06
      8. 8.4.8  REG07
      9. 8.4.9  REG08
      10. 8.4.10 REG09
      11. 8.4.11 REG0A
      12. 8.4.12 REG0B
      13. 8.4.13 REG0C
      14. 8.4.14 REG0D
      15. 8.4.15 REG0E
      16. 8.4.16 REG0F
      17. 8.4.17 REG10
      18. 8.4.18 REG11
      19. 8.4.19 REG12
      20. 8.4.20 REG13
      21. 8.4.21 REG14
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Buck Input Capacitor
        3. 9.2.2.3 System Output Capacitor
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Glossary
    6. 12.6 Electrostatic Discharge Caution
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision B (May 2018) to Revision C (October 2022)

  • Deleted WEBENCH throughout data sheetGo
  • Updated inclusive terminology throughout data sheetGo
  • Changed PMID description Go
  • Changed REG01 default setting from 06 to 05Go

Changes from Revision A (May 216) to Revision B (May 2018)

  • Added "SW (peak for 10 ns duration)" To the Absolute Maximum Rating Go
  • Updated the Section 7.4 valuesGo
  • Changed VSYS TYP value From: VBAT + 50 mV To: I(SYS) + 150 mVGo
  • Changed the title of Figure 7-4 From: Charge Current Accuracy To: I2C Setting Go
  • Changed axis title of Figure 7-8 From: BAT Voltage (V) To: Input Current Limit (mA)Go
  • Changed VVREF to VREGN in Figure 8-7 Go
  • Changed VVREF to VREGN in Equation 2 Go
  • Changed VREF to VREGN in Figure 8-8 Go
  • Added sentence to the Battery Monitor secton "In battery only mode, .."Go
  • Changed bit 5 From: 0 To: 1 in Table 8-11 Go
  • Changed the Description values of Table 8-26 From: mV To: mAGo
  • Changed the Type values of Bits 6 to Bit 0 in Table 8-28 From: R/W To: RGo
  • Added VREF system pullup voltage to Table 9-1 Go
  • Changed Figure 9-3 Go

Changes from Revision * (March 2015) to Revision A (May 2016)

  • Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go