SLUSBU9H March   2014  – June 2021 BQ2970 , BQ2971 , BQ2972 , BQ2973

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1. 6.1 Pin Descriptions
      1. 6.1.1 Supply Input: BAT
      2. 6.1.2 Cell Negative Connection: VSS
      3. 6.1.3 Voltage Sense Node: V–
      4. 6.1.4 Discharge FET Gate Drive Output: DOUT
      5. 6.1.5 Charge FET Gate Drive Output: COUT
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 DC Characteristics
    6. 7.6 Programmable Fault Detection Thresholds
    7. 7.7 Programmable Fault Detection Timer Ranges
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Timing Charts
    2. 8.2 Test Circuits
    3. 8.3 Test Circuit Diagrams
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Operation
      2. 9.4.2 Overcharge Status
      3. 9.4.3 Over-Discharge Status
      4. 9.4.4 Discharge Overcurrent Status (Discharge Overcurrent, Load Short-Circuit)
      5. 9.4.5 Charge Overcurrent Status
      6. 9.4.6 0-V Charging Function Enabled
      7. 9.4.7 0-V Charging Inhibit Function
      8. 9.4.8 Delay Circuit
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Performance Plots
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Documentation
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison Table

PART NUMBER(1) OVP (V) OVP DELAY (s) UVP (V) UVP DELAY (ms) OCC (V) OCC DELAY (ms) OCD (V) OCD DELAY (ms) SCD (V) SCD DELAY (µs)
BQ29700 4.275 1.25 2.800 144 –0.100 8 0.100 20 0.5 250
BQ29701 4.280 1.25 2.300 144 –0.100 8 0.125 8 0.5 250
BQ29702 4.350 1 2.800 96 –0.155 8 0.160 16 0.3 250
BQ29703 4.425 1.25 2.300 20 –0.100 8 0.160 8 0.5 250
BQ29704 4.425 1.25 2.500 20 –0.100 8 0.125 8 0.5 250
BQ29705 4.425 1.25 2.500 20 –0.100 8 0.150 8 0.5 250
BQ29706 3.850 1.25 2.500 144 –0.150 8 0.200 8 0.6 250
BQ29707 4.280 1 2.800 96 –0.090 6 0.090 16 0.3 250
BQ29716 4.425 1.25 2.300 20 –0.100 8 0.165 8 0.5 250
BQ29717 4.425 1.25 2.500 20 –0.100 8 0.130 8 0.5 250
BQ29718 4.425 1.25 2.500 20 –0.100 8 0.100 8 0.5 250
BQ29723 4.425 1 2.500 96 –0.060 4 0.100 8 0.3 250
BQ29728 4.280 1.25 2.800 144 –0.100 8 0.150 8 0.5 250
BQ29729 4.275 1.25 2.300 20 –0.100 8 0.130 8 0.5 250
BQ29732 4.280 1.25 2.500 144 –0.100 8 0.190 8 0.5 250
BQ29733 4.400 1.25 2.800 20 –0.100 8 0.120 8 0.3 250
BQ29737 4.250 1 2.800 96 –0.050 16 0.100 16 0.3 250
BQ297xy 3.85–4.6 0.25, 1, 1.25, 4.5 2.0–2.8 20, 96, 125, 144 –0.045 to –0.155 4, 6, 8, 16 0.090–0.200 8, 16, 20, 48 0.3, 0.4, 0.5, 0.6 250
(1) All of the protections have a recovery delay time. The recovery timer starts as soon as the fault is triggered. The device starts to check for a recovery condition only when the recovery timer expires. This is NOT a delay time between recovery condition to FETs recovery. OVP recovery delay = 12 ms; UVP/OCC/OCD recovery delay = 8 ms.