SWRS116F August   2011  – October 2014 CC1175

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Configuration
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Recommended Operating Conditions (General Characteristics)
    4. 4.4  Thermal Resistance Characteristics for RHB Package
    5. 4.5  RF Characteristics
    6. 4.6  Regulatory Standards
    7. 4.7  Current Consumption, Static Modes
    8. 4.8  Current Consumption, Transmit Modes
      1. 4.8.1 950-MHz Band (High-Performance Mode)
      2. 4.8.2 868-, 915-, and 920-MHz Bands (High-Performance Mode)
      3. 4.8.3 434-MHz Band (High-Performance Mode)
      4. 4.8.4 169-MHz Band (High-Performance Mode)
      5. 4.8.5 Low-Power Mode
    9. 4.9  Transmit Parameters
    10. 4.10 PLL Parameters
      1. 4.10.1 High-Performance Mode
      2. 4.10.2 Low-Power Mode
    11. 4.11 Wake-up and Timing
    12. 4.12 High-Speed Crystal Oscillator
    13. 4.13 High-Speed Clock Input (TCXO)data to TCXO table
    14. 4.14 32-kHz Clock Input
    15. 4.15 Low-Speed RC Oscillator
    16. 4.16 I/O and Reset
    17. 4.17 Temperature Sensor
    18. 4.18 Typical Characteristics
  5. 5Detailed Description
    1. 5.1 Block Diagram
    2. 5.2 Frequency Synthesizer
    3. 5.3 Transmitter
    4. 5.4 Radio Control and User Interface
    5. 5.5 Low-Power and High-Performance Modes
  6. 6Typical Application Circuit
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 Configuration Software
      2. 7.1.2 Device and Development-Support Tool Nomenclature
    2. 7.2 Documentation Support
    3. 7.3 Community Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Mechanical Packaging and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.