SWRS116F August   2011  – October 2014 CC1175

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Configuration
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Recommended Operating Conditions (General Characteristics)
    4. 4.4  Thermal Resistance Characteristics for RHB Package
    5. 4.5  RF Characteristics
    6. 4.6  Regulatory Standards
    7. 4.7  Current Consumption, Static Modes
    8. 4.8  Current Consumption, Transmit Modes
      1. 4.8.1 950-MHz Band (High-Performance Mode)
      2. 4.8.2 868-, 915-, and 920-MHz Bands (High-Performance Mode)
      3. 4.8.3 434-MHz Band (High-Performance Mode)
      4. 4.8.4 169-MHz Band (High-Performance Mode)
      5. 4.8.5 Low-Power Mode
    9. 4.9  Transmit Parameters
    10. 4.10 PLL Parameters
      1. 4.10.1 High-Performance Mode
      2. 4.10.2 Low-Power Mode
    11. 4.11 Wake-up and Timing
    12. 4.12 High-Speed Crystal Oscillator
    13. 4.13 High-Speed Clock Input (TCXO)data to TCXO table
    14. 4.14 32-kHz Clock Input
    15. 4.15 Low-Speed RC Oscillator
    16. 4.16 I/O and Reset
    17. 4.17 Temperature Sensor
    18. 4.18 Typical Characteristics
  5. 5Detailed Description
    1. 5.1 Block Diagram
    2. 5.2 Frequency Synthesizer
    3. 5.3 Transmitter
    4. 5.4 Radio Control and User Interface
    5. 5.5 Low-Power and High-Performance Modes
  6. 6Typical Application Circuit
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 Configuration Software
      2. 7.1.2 Device and Development-Support Tool Nomenclature
    2. 7.2 Documentation Support
    3. 7.3 Community Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Typical Application Circuit

NOTE

This section is intended only as an introduction.

Very few external components are required for the operation of the CC1175 device. Figure 6-1 shows a typical application circuit. The board layout will greatly influence the RF performance of the CC1175 device. Figure 6-1 does not show decoupling capacitors for power pins.

typapp_swrs116.gifFigure 6-1 Typical Application Circuit

For more information, see the reference designs available for the CC1175 device in Section 7.2, Documentation Support.