SCAS882E June   2009  – October 2016 CDCE62002

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Thermal Information
    3. 7.3 Electrical Characteristics
    4. 7.4 Timing Requirements
    5. 7.5 SPI Bus Timing Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
      1. 9.2.1 Interface and Control Block
      2. 9.2.2 Input Block
      3. 9.2.3 Output Block
      4. 9.2.4 Synthesizer Block
      5. 9.2.5 Computing the Output Frequency
    3. 9.3 Feature Description
      1. 9.3.1 Phase Noise Analysis
      2. 9.3.2 Output-to-Output Isolationthe OUTPUT TO OUTPUT ISOLATION section
      3. 9.3.3 Device Control
      4. 9.3.4 External Control Pins
        1. 9.3.4.1 Factory Default Programming
      5. 9.3.5 Input Block
        1. 9.3.5.1 Reference Input Buffer
        2. 9.3.5.2 Smart Multiplexer Dividers
        3. 9.3.5.3 Auxiliary Input Port
        4. 9.3.5.4 Output Block
        5. 9.3.5.5 Synthesizer Block
        6. 9.3.5.6 Input Divider
        7. 9.3.5.7 Feedback and Feedback Bypass Divider
          1. 9.3.5.7.1 VCO Select
          2. 9.3.5.7.2 Prescaler
          3. 9.3.5.7.3 Loop Filter
        8. 9.3.5.8 Internal Loop Filter Component Configuration
      6. 9.3.6 Lock Detect
      7. 9.3.7 Crystal Input Interface
      8. 9.3.8 VCO Calibration
      9. 9.3.9 Start-Up Time Estimation
    4. 9.4 Device Functional Modes
      1. 9.4.1 Clock Generator
      2. 9.4.2 SERDES Start-Up and Clock Cleaner
      3. 9.4.3 Clocking ADCS With the CDCE62002
    5. 9.5 Programming
      1. 9.5.1 Interface and Control Block
        1. 9.5.1.1 SPI (Serial Peripheral Interface)
        2. 9.5.1.2 SPI Interface Master
        3. 9.5.1.3 SPI Consecutive Read/Write Cycles to the CDCE62002
        4. 9.5.1.4 Writing to the CDCE62002
        5. 9.5.1.5 Reading from the CDCE62002
        6. 9.5.1.6 Writing to EEPROM
        7. 9.5.1.7 CDCE62002 SPI Command Structure
      2. 9.5.2 Device Configuration
    6. 9.6 Register Maps
      1. 9.6.1 Device Registers: Register 0 Address 0x00
      2. 9.6.2 Device Registers: Register 1 Address 0x01
      3. 9.6.3 Device Registers: Register 2 Address 0x02
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.