SCAS871H February   2009  – January 2016 CDCM61004

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Pin Configuration and Functions
    1. 6.1 Pin Characteristics
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Typical Output Phase Noise CharacteristicsCorrected units for tRJIT (RMS phase jitter); changed to fs, RMS from ps, RMS
    7. 7.7  Typical Output Jitter Characteristics
    8. 7.8  Crystal Characteristics
    9. 7.9  Dissipation Ratings
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Phase-Locked Loop (PLL)
      2. 9.3.2  Configuring the PLL
      3. 9.3.3  Crystal Input Interface
      4. 9.3.4  Phase Frequency Detector (PFD)
      5. 9.3.5  Charge Pump (CP)
      6. 9.3.6  On-Chip PLL Loop Filter
      7. 9.3.7  Prescaler Divider and Feedback Divider
      8. 9.3.8  On-Chip VCO
      9. 9.3.9  LVCMOS Input Interface
      10. 9.3.10 Output Divider
      11. 9.3.11 Output Buffer
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Start-Up Time Estimation
      2. 10.1.2 Output Termination
      3. 10.1.3 LVPECL Termination
      4. 10.1.4 LVDS Termination
      5. 10.1.5 LVCMOS Termination
      6. 10.1.6 Interfacing Between LVPECL and HCSL
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Device Selection
          1. 10.2.2.1.1 Calculation Using LCM
        2. 10.2.2.2 Device Configuration
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Power Considerations
    2. 11.2 Thermal Management
    3. 11.3 Power-Supply Filtering
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Parameter Measurement Information

This section describes the function of each block for the CDCM61004. Figure 7 through Figure 13 illustrate how the device should be set up for a variety of output configurations.

CDCM61004 test_lvcmos_out_load_cas869.gif Figure 7. LVCMOS Output Loading During Device Test
CDCM61004 test_lvcmos_ac_config_cas869.gif Figure 8. LVCMOS AC Configuration During Device Test
CDCM61004 test_lvpecl_dc_config_cas869.gif Figure 9. LVPECL DC Configuration During Device Test
CDCM61004 test_lvpecl_ac_config_cas869.gif Figure 10. LVPECL AC Configuration During Device Test
CDCM61004 test_lvds_dc_config_cas869.gif Figure 11. LVDS DC Configuration During Device Test
CDCM61004 test_lvds_ac_config_cas871.gif Figure 12. LVDS AC Configuration During Device Test
CDCM61004 test_vout_tr_tf_cas869.gif Figure 13. Output Voltage and Rise and Fall Times