SLPS200D January   2018  – October 2023 CSD16401Q5

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  7. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Support Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 Thermal Information

TA = 25°C (unless otherwise noted)
THERMAL METRICMINTYPMAXUNIT
RθJCThermal resistance, junction-to-case(1)0.8°C/W
RθJAThermal resistance, junction-to-ambient(1)(2)50°C/W
(1) RθJC is determined with the device mounted on a 1-in (2.54-cm) square, 2-oz(0.071-mm) thick Cu pad on a 1.5-in × 1.5-in (3.81-cm × 3.81-cm), 0.06-in (1.52-mm) thick FR4 board. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1 in2 (6.45 cm2) of 2-oz (0.071-mm) thick Cu.
GUID-789B4BEB-5A88-4E8A-A191-3932E7C50315-low.gif
Max RθJA = 50°C/W when mounted on 1 in2 (6.45 cm2) of 2-oz (0.071-mm) thick Cu.
GUID-27A42E3A-061C-428E-B222-CD4623FEAD93-low.gif
Max RθJA = 125°C/W when mounted on minimum pad area of 2-oz (0.071-mm) thick Cu.