SLPS407C September   2013  – March 2017 CSD19531KCS

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 KCS Package Dimensions

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • KCS|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (June 2014) to C Revision

  • Added Receiving Notification of Documentation Updates section and Community Resources section to the Device and Documentation Support sectionGo
  • Changed package drawing in KCS Package Dimensions sectionGo

Changes from A Revision (May 2014) to B Revision

  • Added value for max QgGo

Changes from * Revision (September 2013) to A Revision

  • Updated the silicon limited currents to reflect increase in device operating temperature range Go
  • Increased pulsed current to reflect new conditions Go
  • Increased max power dissipation to reflect new conditions Go
  • Increased operating and junction temperature range to 175ºC Go
  • Updated the pulsed drain current conditionsGo
  • Changed Figure 1 from a normalized RθJA curve to a normalized RθJC curve Go
  • Updated Figure 6 to reflect increase in device operating temperature range Go
  • Updated Figure 8 to reflect increase in device operating temperature range Go
  • Updated Figure 10 to reflect measured SOA data Go
  • Updated Figure 12 to reflect increase in device operating temperature range Go