SLPS549B August   2015  – November 2022 CSD19537Q3

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Community Resources
    2. 6.2 Trademarks
    3. 6.3 Electrostatic Discharge Caution
    4. 6.4 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q3 Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening
    4. 7.4 Q3 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Q3 Tape and Reel Information

GUID-78C0A91A-BCE2-42A6-A890-228C67CA189F-low.gif

Notes:

  1. 10 sprocket hole pitch cumulative tolerance ±0.2
  2. Camber not to exceed 1 mm in 100 mm, noncumulative over 250 mm
  3. Material: black static dissipative polystyrene
  4. All dimensions are in mm (unless otherwise specified).
  5. Thickness: 0.30 ±0.05 mm
  6. MSL1 260°C (IR and Convection) PbF-Reflow Compatible