SLPS690B August   2017  – February 2022 CSD22205L

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Trademarks
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 CSD22205L Package Dimensions
    2. 7.2 Land Pattern Recommendation
    3. 7.3 Stencil Recommendation

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YMG|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 Thermal Information

TA = 25°C (unless otherwise stated)
THERMAL METRIC MIN TYP MAX UNIT
RθJA Junction-to-ambient thermal resistance(2) 75 °C/W
Junction-to-ambient thermal resistance(1) 225
(1) Device mounted on FR4 material with minimum Cu mounting area.
(2) Device mounted on FR4 material with 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu.

GUID-20220215-SS0I-1PSP-DG6J-9S3QFBSPNC2C-low.gif
Typ RθJA =75°C/W when mounted on 1 in2 of 2-oz Cu.
GUID-20220215-SS0I-M02G-TP5N-7X0SSMJVW1SD-low.gif
Typ RθJA = 225°C/W when mounted on minimum pad area of 2-oz Cu.