SLAS528B August   2017  – January 2018 DAC5672A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics
    7. 6.7  Electrical Characteristics: AC Characteristics
    8. 6.8  Electrical Characteristics: Digital Characteristics
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Interfaces
      2. 7.3.2 Dual-Bus Data Interface and Timing
      3. 7.3.3 Single-Bus Interleaved Data Interface and Timing
    4. 7.4 Device Functional Modes
      1. 7.4.1 DAC Transfer Function
      2. 7.4.2 Analog Outputs
      3. 7.4.3 Output Configurations
      4. 7.4.4 Differential With Transformer
      5. 7.4.5 Single-Ended Configuration
      6. 7.4.6 Reference Operation
        1. 7.4.6.1 Internal Reference
        2. 7.4.6.2 External Reference
        3. 7.4.6.3 Gain Setting Option
        4. 7.4.6.4 Sleep Mode
    5. 7.5 Programming
      1. 7.5.1 Digital Inputs and Timing
        1. 7.5.1.1 Digital Inputs
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

The DAC5672A EVM layout should be used as a reference for the layout to obtain the best performance. A sample layout is shown in Figure 27 through Figure 30. Some important layout recommendations are:

  1. Use a single ground plane. Keep the digital and analog signals on distinct separate sections of the board. This may be virtually divided down the middle of the device package when doing placement and layout.
  2. Keep the analog outputs as far away from the switching clocks and digital signals as possible. This will keep coupling from the digital circuits to the analog outputs to a minimum.
  3. Decoupling caps should be kept close to the power pins of the device.

10.2 Layout Example

The EVM is constructed on a 4-layer, 5.1-inch x 4.8-inch, 0.062-inch thick PCB using FR−4 material. Figure 27 through Figure 30 show the PCB layout for the EVM.

DAC5672A dac5672-62-52-top-layer-1.gif Figure 27. Top Layer 1
DAC5672A dac5672-62-52-layer-2-ground-plane.gif Figure 28. Ground Plane Layer 2
DAC5672A dac5672-62-52-layer-3-power-plane.gif Figure 29. Power Plane Layer 3
DAC5672A dac5672-62-52-layer-4-bottom-layer.gif Figure 30. Bottom Layer 4