SBOS704B May   2015  – March 2016 DRV421

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fluxgate Sensor
      2. 7.3.2  Integrator-Filter Function and Compensation Loop Stability
      3. 7.3.3  H-Bridge Driver for Compensation Coil
      4. 7.3.4  Shunt Sense Amplifier
      5. 7.3.5  Overrange Comparator
      6. 7.3.6  Voltage Reference
      7. 7.3.7  Overload Detection and Control
      8. 7.3.8  Magnetic Core Demagnetization
      9. 7.3.9  Search Function
      10. 7.3.10 Error Flag
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Magnetic Core Design
      2. 8.1.2 Protection Recommendations
    2. 8.2 Typical Application
      1. 8.2.1 Closed-Loop Current Sensing Module
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Differential Closed-Loop Current Sensing Module
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Using the DRV421 in ±15-V Sensor Applications
  9. 9 Power-Supply Recommendations
    1. 9.1 Power-Supply Decoupling
    2. 9.2 Power-On Start Up and Brownout
    3. 9.3 Power Dissipation
      1. 9.3.1 Thermal Pad
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (July 2015) to B Revision

  • Added TI Design Go
  • Added last two Applications bullets Go
  • Changed QFN to WQFN in pin configuration drawing Go
  • Changed QFN to WQFN in Thermal Information table Go
  • Changed QFN to WQFN in Power Dissipation section Go

Changes from * Revision (May 2015) to A Revision

  • Released to productionGo