SLVSCI2A June   2014  – June 2014 DRV8802-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Motor Drivers
      2. 7.3.2 Bridge Control
      3. 7.3.3 Current Regulation
      4. 7.3.4 Decay Mode and Braking
      5. 7.3.5 Blanking Time
      6. 7.3.6 nRESET and nSLEEP Operation
      7. 7.3.7 Protection Circuits
        1. 7.3.7.1 Overcurrent Protection (OCP)
        2. 7.3.7.2 Thermal Shutdown (TSD)
        3. 7.3.7.3 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Drive Current
        2. 8.2.2.2 Slow-Decay SR (Brake Mode)
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
    2. 9.2 Power Supply and Logic Sequencing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Information
      1. 10.3.1 Thermal Protection
      2. 10.3.2 Power Dissipation
      3. 10.3.3 Heatsinking
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Power supply voltage V(VMx) –0.3 47 V
Charge pump voltage VCP, CP1, CP2 –0.3 V(VMx)+7 V
Digital pin voltage xPHASE, xENBL, nSLEEP, nFAULT, nRESET, xI0, xI1, DECAY –0.5 7 V
Reference input voltage V(xVREF) –0.3 4 V
Sense pin voltage V(ISENx) –0.3 0.8 V
H-bridge output Current xOUT1, xOUT2, ISENx Peak motor drive, t < 1 μS Internally limited A
Continuous motor drive(3) 1.6 A
Continuous total power dissipation See the Power Dissipation section
Operating virtual junction temperature, TJ –40 150 °C
Operating ambient temperature, TA –40 125 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Power dissipation and thermal limits must be observed.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –60 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) –2000 2000 V
Charged device model (CDM), per AEC Q100-011 Corner pins (1, 14, 15, and 28) –750 750
Other pins –500 500
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

MIN MAX UNIT
V(VMx) Power supply voltage(1) 8.2 45 V
V(xVREF) VREF input voltage(2) 1 3.5 V
I(OUT1x, OUT2x) H-Bridge Output Current 1.6 A
IL(V3P3OUT) V3P3OUT load current 1 mA
(1) All VMx pins must be connected to the same supply voltage.
(2) Operational at V(xVREF) between 0 V and 1 V, but accuracy is degraded.

6.4 Thermal Information

THERMAL METRIC(1) PWP UNIT
28 PINS
RθJA Junction-to-ambient thermal resistance 38.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 23.3
RθJB Junction-to-board thermal resistance 21.2
ψJT Junction-to-top characterization parameter 0.8
ψJB Junction-to-board characterization parameter 20.9
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temp range of -40°C to 125°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLIES
I(VMx) VMx operating supply current V(VMx) = 24 V, ƒ(PWM) < 50 kHz 5 8 mA
I(VMx_Q) VMx sleep mode supply current V(VMx) = 24 V 10 20 μA
V(UVLO) VMx undervoltage lockout voltage V(VMx) rising 7.8 8.2 V
V3P3OUT REGULATOR
V(V3P3OUT) V3P3OUT voltage IO = 0 to 1 mA 3.1 3.3 3.5 V
LOGIC-LEVEL INPUTS
VIL Input low voltage 0.7 V
VIH Input high voltage 2.1 V
Vhys Input hysteresis 0.45 V
IIL Input low current VI = 0 –20 20 μA
IIH Input high current VI = 3.3 V 100 μA
nFAULT OUTPUT (OPEN-DRAIN OUTPUT)
VOL Output low voltage IO = 5 mA 0.5 V
IOH Output high leakage current VO = 3.3 V 1 μA
DECAY INPUT
VIL Input low threshold voltage For slow decay mode 0 0.8 V
VIH Input high threshold voltage For fast decay mode 2 V
II Input current ±40 µA
H-BRIDGE FETS
rDS(on) HS FET on resistance VM = 24 V, IO = 1 A, TJ = 25°C 0.63 Ω
VM = 24 V, IO = 1 A, TJ = 85°C 0.76 0.9
VM = 24 V, IO = 1 A, TJ = 125°C 0.85 1
rDS(on) LS FET on resistance VM = 24 V, IO = 1 A, TJ = 25°C 0.65 Ω
VM = 24 V, IO = 1 A, TJ = 85°C 0.78 0.9
VM = 24 V, IO = 1 A, TJ = 125°C 0.85 1
Ilkg(OFF) Off-state leakage current –20 20 μA
MOTOR DRIVER
ƒ(PWM) Internal PWM frequency 50 kHz
t(blank) Current-sense blanking time 3.75 μs
tr Rise time VM = 24 V 100 360 ns
tf Fall time VM = 24 V 80 250 ns
t(dead) Dead time 400 ns
PROTECTION CIRCUITS
I(OCP) Overcurrent protection trip level 1.8 5 A
T(SD) Thermal shutdown temperature Die temperature 150 160 180 °C
CURRENT CONTROL
I(xVREF) xVREF input current V(xVREF) = 3.3 V –3 3 μA
V(TRIP) xISENSE trip voltage V(xVREF) = 3.3 V, 100% current setting 635 660 685 mV
V(xVREF) = 3.3 V, 71% current setting 445 469 492
V(xVREF) = 3.3 V, 38% current setting 225 251 276
G(ISENx) Current sense amplifier gain Reference only 5 V/V

6.6 Typical Characteristics

C001_SLVSCI2.png
Figure 1. I(VMx) vs V(VMx)
C003_SLVSCI2.png
Figure 3. rDS(on) vs V(VMx)
C002_SLVSCI2.png
Figure 2. I(VMx_Q) vs V(VMx)
C004_SLVSCI2.png
Figure 4. rDS(on) vs Temperature