SLVSCH4 July   2014 DRV8842-EP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Motor Driver Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 PWM Motor Drivers
      2. 8.3.2 Bridge Control
      3. 8.3.3 Current Regulation
      4. 8.3.4 Blanking Time
      5. 8.3.5 nRESET and nSLEEP Operation
      6. 8.3.6 Protection Circuits
        1. 8.3.6.1 Overcurrent Protection (OCP)
        2. 8.3.6.2 Thermal Shutdown (TSD)
        3. 8.3.6.3 Undervoltage Lockout (UVLO)
      7. 8.3.7 Thermal Protection
      8. 8.3.8 Heatsinking
    4. 8.4 Device Functional Modes
      1. 8.4.1 Decay Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Power Dissipation
        2. 9.2.2.2 Current Regulation Considerations
        3. 9.2.2.3 Slow, Fast, and Mixed Decay Modes
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
    2. 10.2 Power Supply and Logic Sequencing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

po_pwp_lvsab8.gif

Pin Functions

PIN I/O(1) DESCRIPTION EXTERNAL COMPONENTS OR CONNECTIONS
NAME NO.
POWER AND GROUND
GND 14 — Device ground
28
VM 4 — Bridge A power supply Connect to motor supply (8.2 to 45 V). Both pins must be connected to same supply.
11
V3P3OUT 15 O 3.3-V regulator output Bypass to GND with a 0.47-μF, 6.3-V ceramic capacitor. Can be used to supply VREF.
CP1 1 IO Charge pump flying capacitor Connect a 0.01-μF 50-V capacitor between CP1 and CP2.
CP2 2 IO Charge pump flying capacitor
VCP 3 IO High-side gate drive voltage Connect a 0.1-μF 16-V ceramic capacitor and a 1-MΩ resistor to VM.
CONTROL
IN1 21 I Input 1 Logic input controls state of OUT1. Internal pulldown.
IN2 20 I Input 2 Logic input controls state of OUT2. Internal pulldown.
I0 23 I Current set inputs Sets winding current as a percentage of full-scale. Internal pulldown.
I1 24 I
I2 25 I
I3 26 I
I4 27 I
DECAY 19 I Decay mode Low = slow decay, open = mixed decay,
High = fast decay. Internal pulldown and pullup.
nRESET 16 I Reset input Active-low reset input initializes the logic and disables the H-bridge outputs. Internal pulldown.
nSLEEP 17 I Sleep mode input Logic high to enable device, logic low to enter low-power sleep mode. Internal pulldown.
VREF 12 I Current set reference input Reference voltage for winding current set. Both pins must be connected together on the PCB.
13
STATUS
nFAULT 18 OD Fault Logic low when in fault condition (over-temperature, overcurrent)
OUTPUT
ISEN 6 IO Bridge ground / Isense Connect to current sense resistor. Both pins must be connected together on the PCB.
9
OUT1 5 O Bridge output 1 Connect to motor winding. Both pins must be connected together on the PCB.
10
OUT2 7 O Bridge output 2 Connect to motor winding. Both pins must be connected together on the PCB.
8
(1) Directions: I = input, O = output, OZ = tri-state output, OD = open-drain output, IO = input/output