SNLS643C March   2019  – April 2024 DS90UB953A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Recommended Timing for the Serial Control Bus
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 CSI-2 Receiver
        1. 6.3.1.1 CSI-2 Receiver Operating Modes
        2. 6.3.1.2 CSI-2 Receiver High-Speed Mode
        3. 6.3.1.3 CSI-2 Protocol Layer
        4. 6.3.1.4 CSI-2 Short Packet
        5. 6.3.1.5 CSI-2 Long Packet
        6. 6.3.1.6 CSI-2 Errors and Detection
          1. 6.3.1.6.1 CSI-2 ECC Detection and Correction
          2. 6.3.1.6.2 CSI-2 Check Sum Detection
          3. 6.3.1.6.3 D-PHY Error Detection
          4. 6.3.1.6.4 CSI-2 Receiver Status
      2. 6.3.2 FPD-Link III Forward Channel Transmitter
        1. 6.3.2.1 Frame Format
      3. 6.3.3 FPD-Link III Back Channel Receiver
      4. 6.3.4 Serializer Status and Monitoring
        1. 6.3.4.1 Forward Channel Diagnostics
        2. 6.3.4.2 Back Channel Diagnostics
        3. 6.3.4.3 Voltage and Temperature Sensing
          1. 6.3.4.3.1 Programming Example
        4. 6.3.4.4 Built-In Self Test
      5. 6.3.5 FrameSync Operation
        1. 6.3.5.1 External FrameSync
        2. 6.3.5.2 Internally Generated FrameSync
      6. 6.3.6 GPIO Support
        1. 6.3.6.1 GPIO Status
        2. 6.3.6.2 GPIO Input Control
        3. 6.3.6.3 GPIO Output Control
        4. 6.3.6.4 Forward Channel GPIO
        5. 6.3.6.5 Back Channel GPIO
    4. 6.4 Device Functional Modes
      1. 6.4.1 Clocking Modes
        1. 6.4.1.1 Synchronous Mode
        2. 6.4.1.2 Non-Synchronous Clock Mode
        3. 6.4.1.3 Non-Synchronous Internal Mode
        4. 6.4.1.4 DVP Backwards Compatibility Mode
        5. 6.4.1.5 Configuring CLK_OUT
      2. 6.4.2 MODE
    5. 6.5 Programming
      1. 6.5.1 I2C Interface Configuration
        1. 6.5.1.1 CLK_OUT/IDX
          1. 6.5.1.1.1 IDX
      2. 6.5.2 I2C Interface Operation
      3. 6.5.3 I2C Timing
    6. 6.6 Pattern Generation
      1. 6.6.1 Reference Color Bar Pattern
      2. 6.6.2 Fixed Color Patterns
      3. 6.6.3 Packet Generator Programming
        1. 6.6.3.1 Determining Color Bar Size
      4. 6.6.4 Code Example for Pattern Generator
    7. 6.7 Register Maps
      1. 6.7.1 Main Registers
        1. 6.7.1.1  I2C Device ID Register
        2. 6.7.1.2  Reset
        3. 6.7.1.3  General Configuration
        4. 6.7.1.4  Forward Channel Mode Selection
        5. 6.7.1.5  BC_MODE_SELECT
        6. 6.7.1.6  PLL Clock Control
        7. 6.7.1.7  Clock Output Control 0
        8. 6.7.1.8  Clock Output Control 1
        9. 6.7.1.9  Back Channel Watchdog Control
        10. 6.7.1.10 I2C Control 1
        11. 6.7.1.11 I2C Control 2
        12. 6.7.1.12 SCL High Time
        13. 6.7.1.13 SCL Low Time
        14. 6.7.1.14 Local GPIO DATA
        15. 6.7.1.15 GPIO Input Control
        16. 6.7.1.16 DVP_CFG
        17. 6.7.1.17 DVP_DT
        18. 6.7.1.18 Force BIST Error
        19. 6.7.1.19 Remote BIST Control
        20. 6.7.1.20 Sensor Voltage Gain
        21. 6.7.1.21 Sensor Control 0
        22. 6.7.1.22 Sensor Control 1
        23. 6.7.1.23 Voltage Sensor 0 Thresholds
        24. 6.7.1.24 Voltage Sensor 1 Thresholds
        25. 6.7.1.25 Temperature Sensor Thresholds
        26. 6.7.1.26 CSI-2 Alarm Enable
        27. 6.7.1.27 Alarm Sense Enable
        28. 6.7.1.28 Back Channel Alarm Enable
        29. 6.7.1.29 CSI-2 Polarity Select
        30. 6.7.1.30 CSI-2 LP Mode Polarity
        31. 6.7.1.31 CSI-2 High-Speed RX Enable
        32. 6.7.1.32 CSI-2 Low Power Enable
        33. 6.7.1.33 CSI-2 Termination Enable
        34. 6.7.1.34 CSI-2 Packet Header Control
        35. 6.7.1.35 Back Channel Configuration
        36. 6.7.1.36 Datapath Control 1
        37. 6.7.1.37 Remote Partner Capabilities 1
        38. 6.7.1.38 Partner Deserializer ID
        39. 6.7.1.39 Target 0 ID
        40. 6.7.1.40 Target 1 ID
        41. 6.7.1.41 Target 2 ID
        42. 6.7.1.42 Target 3 ID
        43. 6.7.1.43 Target 4 ID
        44. 6.7.1.44 Target 5 ID
        45. 6.7.1.45 Target 6 ID
        46. 6.7.1.46 Target 7 ID
        47. 6.7.1.47 Target 0 Alias
        48. 6.7.1.48 Target 1 Alias
        49. 6.7.1.49 Target 2 Alias
        50. 6.7.1.50 Target 3 Alias
        51. 6.7.1.51 Target 4 Alias
        52. 6.7.1.52 Target 5 Alias
        53. 6.7.1.53 Target 6 Alias
        54. 6.7.1.54 Target 7 Alias
        55. 6.7.1.55 Back Channel Control
        56. 6.7.1.56 Revision ID
        57. 6.7.1.57 Device Status
        58. 6.7.1.58 General Status
        59. 6.7.1.59 GPIO Pin Status
        60. 6.7.1.60 BIST Error Count
        61. 6.7.1.61 CRC Error Count 1
        62. 6.7.1.62 CRC Error Count 2
        63. 6.7.1.63 Sensor Status
        64. 6.7.1.64 Sensor V0
        65. 6.7.1.65 Sensor V1
        66. 6.7.1.66 Sensor T
        67. 6.7.1.67 CSI-2 Error Count
        68. 6.7.1.68 CSI-2 Error Status
        69. 6.7.1.69 CSI-2 Errors Data Lanes 0 and 1
        70. 6.7.1.70 CSI-2 Errors Data Lanes 2 and 3
        71. 6.7.1.71 CSI-2 Errors Clock Lane
        72. 6.7.1.72 CSI-2 Packet Header Data
        73. 6.7.1.73 Packet Header Word Count 0
        74. 6.7.1.74 Packet Header Word Count 1
        75. 6.7.1.75 CSI-2 ECC
        76. 6.7.1.76 IND_ACC_CTL
        77. 6.7.1.77 IND_ACC_ADDR
        78. 6.7.1.78 IND_ACC_DATA
        79. 6.7.1.79 FPD3_TX_ID0
        80. 6.7.1.80 FPD3_TX_ID1
        81. 6.7.1.81 FPD3_TX_ID2
        82. 6.7.1.82 FPD3_TX_ID3
        83. 6.7.1.83 FPD3_TX_ID4
        84. 6.7.1.84 FPD3_TX_ID5
      2. 6.7.2 Indirect Access Registers
        1. 6.7.2.1 PATGEN Registers
        2. 6.7.2.2 Analog Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Power-over-Coax
    2. 7.2 Typical Applications
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 CSI-2 Interface
        2. 7.2.2.2 FPD-Link III Input / Output
        3. 7.2.2.3 Internal Regulator Bypassing
        4. 7.2.2.4 Loop Filter Decoupling
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power-Up Sequencing
        1. 7.3.1.1 System Initialization
          1. 7.3.1.1.1 Code Example for Temperature Ramp Initialization
      2. 7.3.2 Power Down (PDB)
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 CSI-2 Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics

Over recommended operating supply and temperature ranges unless otherwisespecified.
PARAMETERTEST CONDITIONSPIN OR FREQUENCYMINTYPMAXUNIT
POWER CONSUMPTION
IDD_TOTALSupply current416-MHz CSI Input Clock, 4 Lane Mode, Checkerboard PatternVDDPLL, VDDD, VDDDRV160225mA
IDDPLLVDDPLL5580
IDDDVDDD4570
IDDDRVVDDDRV6075
1.8-V LVCMOS I/O (VDD) = 1.71V to 1.89V)
VOHHigh level output voltageIOH = –4mAGPIO[3:0], CLK_OUTV(VDD) – 0.45V(VDD)V
VOLLow level output voltageIOL = +4mAGPIO[3:0], CLK_OUTGND0.45V
VIHHigh level input voltageGPIO[3:0], PDB, CLKINV(VDD) × 0.65V(VDD)V
VILLow level input voltageGPIO[3:0], PDB, CLKINGNDV(VDD) × 0.35V
IIHInput high currentVIN = V(VDD)GPIO[3:0], PDB, CLKIN20µA
IILInput low currentVIN = GNDGPIO[3:0], PDB, CLKIN-20µA
IOSOutput short-circuit currentVOUT = 0V-36mA
IOZTRI-STATE output currentVOUT = V(VDD), VOUT = GNDGPIO[3:0], CLK_OUT±20µA
CINInput capacitance5pF
FPD-LINK III INPUT/OUTPUT
VIN-BCSingle-ended input voltageCoaxial configuration, 50Ω, maximum cable lengthDOUT+, DOUT-120mV
VID-BCDifferential input voltageSTP configuration, 100Ω, maximum cable lengthDOUT+, DOUT-240
EH-FCForward channel eye heightCoaxial configuration, FPD-Link forward channel = 4.16GbpsDOUT+, DOUT-425mVp-p
STP configuration, FPD-Link forward channel = 4.16GbpsDOUT+, DOUT-850
tTR-FCForward channel output transition timeFPD-Link forward channel = 4.16Gbps;  20% to 80%DOUT+, DOUT-65ps
tJIT-FCForward channel output jitterSynchronous mode, measured with f/15 –3dB CDR Loop BWDOUT+, DOUT-0.21UI
Non-synchronous mode, measured with f/15 –3dB CDR Loop BWDOUT+, DOUT-0.22
fREFInternal reference frequencyNon-synchronous internal clocking mode24.225.5MHz
FPD-LINK III DRIVER SPECIFICATIONS (DIFFERENTIAL)
VODp-pOutput differential voltageRL = 100ΩDOUT+, DOUT-104011501340mVp-p
ΔVODOutput voltage imbalanceDOUT+, DOUT-524mV
VOSOutput differential offset voltageDOUT+, DOUT-575mV
ΔVOSOffset voltage imbalanceDOUT+, DOUT-2mV
IOSOutput short-circuit currentDOUT = 0VDOUT+, DOUT-–22mA
RTInternal termination resistanceBetween DOUT+ and DOUT-DOUT+, DOUT-80100120Ω
FPD-LINK III DRIVER SPECIFICATIONS (SINGLE-ENDED)
VOUTOutput single-ended voltageRL = 50ΩDOUT+, DOUT-520575670mVp-p
IOSOutput short-circuit currentDOUT = 0VDOUT+, DOUT-–22mA
RTSingle-ended termination resistanceDOUT+, DOUT-405060Ω
VOLTAGE AND TEMPERATURE SENSING
VACCVoltage accuracySee Voltage and Temperature SensingGPIO[1:0]±1LSB
TACCTemperature accuracySee Voltage and Temperature Sensing±1LSB
CSI-2 HS INTERFACE DC SPECIFICATIONS
VCMRX(DC)Common-mode voltage HS receive modeCSI_D3P/N, CSI_D2P/N,
CSI_D1P/N, CSI_D0P/N,
CSI_CLKP/N		70330mV
VIDTHDifferential input high thresholdCSI_D3P/N, CSI_D2P/N,
CSI_D1P/N, CSI_D0P/N,
CSI_CLKP/N		70mV
VIDTLDifferential input low thresholdCSI_D3P/N, CSI_D2P/N,
CSI_D1P/N, CSI_D0P/N,
CSI_CLKP/N		–70mV
ZIDDifferential input impedanceCSI_D3P/N, CSI_D2P/N,
CSI_D1P/N, CSI_D0P/N,
CSI_CLKP/N		80100125Ω
CSI-2 HS INTERFACE AC SPECIFICATIONS
tHOLDData to clock setup timeCSI_D3P/N, CSI_D2P/N,
CSI_D1P/N, CSI_D0P/N,
CSI_CLKP/N		0.15UI
tSETUPData to clock hold timeCSI_D3P/N, CSI_D2P/N,
CSI_D1P/N, CSI_D0P/N,
CSI_CLKP/N		0.15UI
CSI-2 LP INTERFACE DC SPECIFICATIONS
VIHLogic high input voltageCSI_D3P/N, CSI_D2P/N,
CSI_D1P/N, CSI_D0P/N,
CSI_CLKP/N		880790mV
VILLogic low input voltageCSI_D3P/N, CSI_D2P/N,
CSI_D1P/N, CSI_D0P/N,
CSI_CLKP/N		710550mV
VHYSTInput hysteresisCSI_D3P/N, CSI_D2P/N,
CSI_D1P/N, CSI_D0P/N,
CSI_CLKP/N		2575mV
LVCMOS I/O
tCLHLVCMOS low-to-high transition timeV(VDD) = 1.71 to 1.89VGPIO[3:0]2ns
tCHLLVCMOS high-to-low transition timeV(VDD) = 1.71 to 1.89VGPIO[3:0]2ns
tPDBPDB reset pulse widthVoltage supplies applied and stablePDB3ms
SERIAL CONTROL BUS
VIHInput high levelI2C_SCL, I2C_SDA0.7 × V(I2C)V(I2C)mV
VILInput low levelI2C_SCL, I2C_SDAGND0.3 × V(I2C)mV
VHYInput hysteresisI2C_SCL, I2C_SDA>50mV
VOLOutput low levelV(I2C) < 2V,  IOL = 3mA, Standard-mode/Fast-modeI2C_SCL, I2C_SDA00.2 × V(I2C)V
V(I2C) < 2V,  IOL = 20mA, Fast-mode plusI2C_SCL, I2C_SDA00.2 × V(I2C)V
V(I2C) > 2V,  IOL = 3mA, Standard-mode/Fast-modeI2C_SCL, I2C_SDA00.4V
V(I2C) > 2V,  IOL = 20mA, Fast-mode plusI2C_SCL, I2C_SDA00.4V
IIHInput high currentVIN = V(I2C)I2C_SCL, I2C_SDA-1010µA
IILInput low currentVIN = 0VI2C_SCL, I2C_SDA-1010µA
IILInput low currentVIN = 0VI2C_SCL, I2C_SDA-1010µA
CINInput capacitanceI2C_SCL, I2C_SDA5pf