SNLS336J October   2010  – November 2014 DS90UH925Q-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics
    6. 6.6  AC Electrical Characteristics
    7. 6.7  DC and AC Serial Control Bus Characteristics
    8. 6.8  Recommended Timing for Serial Control Bus
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Charateristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High Speed Forward Channel Data Transfer
      2. 7.3.2  Low Speed Back Channel Data Transfer
      3. 7.3.3  Backward Compatible Mode
      4. 7.3.4  Common Mode Filter Pin (CMF)
      5. 7.3.5  Video Control Signal Filter
      6. 7.3.6  Power Down (PDB)
      7. 7.3.7  Remote Auto Power Down Mode
      8. 7.3.8  LVCMOS VDDIO Option
      9. 7.3.9  Input PCLK Loss Detect
      10. 7.3.10 Serial Link Fault Detect
      11. 7.3.11 Pixel Clock Edge Select (RFB)
      12. 7.3.12 Low Frequency Optimization (LFMODE)
      13. 7.3.13 Interrupt Pin — Functional Description and Usage (INTB)
      14. 7.3.14 EMI Reduction Features
        1. 7.3.14.1 Input SSC Tolerance (SSCT)
        2. 7.3.14.2 GPIO[3:0] and GPO_REG[8:4]
          1. 7.3.14.2.1 GPIO[3:0] Enable Sequence
          2. 7.3.14.2.2 GPO_REG[8:4] Enable Sequence
        3. 7.3.14.3 I2S Transmitting
          1. 7.3.14.3.1 Secondary I2S Channel
        4. 7.3.14.4 HDCP
        5. 7.3.14.5 Built In Self Test (BIST)
          1. 7.3.14.5.1 BIST Configuration and Status
            1. 7.3.14.5.1.1 Sample BIST Sequence
          2. 7.3.14.5.2 Forward Channel and Back Channel Error Checking
        6. 7.3.14.6 Internal Pattern Generation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Configuration Select (MODE_SEL)
      2. 7.4.2 HDCP Repeater
      3. 7.4.3 Repeater Configuration
      4. 7.4.4 Repeater Connections
    5. 7.5 Programming
      1. 7.5.1 Serial Control Bus
    6. 7.6 Register Maps
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Up Requirements and PDB Pin
    2. 9.2 CML Interconnect Guidelines
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings (1)(2)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply Voltage – VDD33 -0.3 4.0 V
Supply Voltage – VDDIO -0.3 4.0 V
LVCMOS I/O Voltage(3) -0.3 VDDIO + 0.3 V
Serializer Output Voltage -0.3 2.75 V
Junction Temperature 150 °C
(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(2) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
(3) The maximum limit (VDDIO +0.3V) does not apply to the PDB pin during the transition to the power down state (PDB transitioning from HIGH to LOW).

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range -65 +150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) ±8 ±8 kV
Charged device model (CDM), per AEC Q100-011 ±1.25 ±1.25
Machine Model (MM) ±250 ±250 V
ESD Rating (IEC 61000-4-2, powered-up only)
RD= 330Ω, CS = 150pF		 Air Discharge
(DOUT+, DOUT-)		 ±15 ±15 kV
Contact Discharge
(DOUT+, DOUT-)		 ±8 ±8
ESD Rating (ISO 10605)
RD= 330Ω, CS = 150pF/330pF
RD= 2KΩ, CS = 150pF/330pF		 Air Discharge
(DOUT+, DOUT-)		 ±15 ±15
Contact Discharge
(DOUT+, DOUT-)		 ±8 ±8
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply Voltage (VDD33) 3.0 3.3 3.6 V
LVCMOS Supply Voltage (VDDIO) 3.0 3.3 3.6 V
OR
LVCMOS Supply Voltage (VDDIO) 1.71 1.8 1.89 V
Operating Free Air Temperature (TA) −40 25 105 °C
PCLK Frequency 5 85 MHz
Supply Noise 100 mVP-P

6.4 Thermal Information

THERMAL METRIC(1) RHS UNIT
48 PINS
RθJA Junction-to-ambient thermal resistance 35 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 5.2
RθJB Junction-to-board thermal resistance 5.5
ψJT Junction-to-top characterization parameter 0.1
ψJB Junction-to-board characterization parameter 5.5
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 DC Electrical Characteristics(1)(2)(3)

Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER TEST CONDITIONS PIN/FREQ. MIN TYP MAX UNIT
LVCMOS I/O DC SPECIFICATIONS
VIH High Level Input Voltage VDDIO = 3.0 to 3.6V PDB 2.0 VDDIO V
VIL Low Level Input Voltage VDDIO = 3.0 to 3.6V GND 0.8 V
IIN Input Current VIN = 0V or VDDIO = 3.0 to 3.6V −10 ±1 10 μA
VIH High Level Input Voltage VDDIO = 3.0 to 3.6V R[7:0], G[7:0], B[7:0], HS, VS, DE, PCLK, I2S_CLK, I2S_WC, I2S_DA, I2S_DB 2.0 VDDIO V
VDDIO = 1.71 to 1.89V 0.65*
VDDIO		 VDDIO V
VIL Low Level Input Voltage VDDIO = 3.0 to 3.6V GND 0.8 V
VDDIO = 1.71 to 1.89V GND 0.35*
VDDIO		 V
IIN Input Current VIN = 0V or VDDIO VDDIO = 3.0
to 3.6V		 −10 ±1 10 μA
VDDIO = 1.71
to 1.89V		 −10 ±1 10 μA
VOH High Level Output Voltage IOH = −4mA VDDIO = 3.0 to 3.6V GPIO[3:0], GPO_REG[8:4] 2.4 VDDIO V
VDDIO = 1.71
to 1.89V		 VDDIO - 0.45 VDDIO V
VOL Low Level Output Voltage IOL = +4mA VDDIO = 3.0 to 3.6V GND 0.4 V
VDDIO = 1.71
to 1.89V		 GND 0.35 V
IOS Output Short Circuit Current VOUT = 0V −50 mA
IOZ TRI-STATE® Output Current VOUT = 0V or VDDIO, PDB = L, −10 10 μA
FPD-LINK III CML DRIVER DC SPECIFICATIONS
VODp-p Differential Output Voltage
(DOUT+) – (DOUT-)		 RL = 100Ω, Figure 1 DOUT+, DOUT- 1160 1250 1340 mVp-p
ΔVOD Output Voltage Unbalance 1 50 mV
VOS Offset Voltage – Single-ended RL = 100Ω, Figure 1 2.5-0.25*VODp-p (TYP) V
ΔVOS Offset Voltage Unbalance
Single-ended		 1 50 mV
IOS Output Short Circuit Current DOUT+/- = 0V, PDB = L or H
 −38 mA
RT Internal Termination Resistor - Single ended 40 52 62 Ω
SUPPLY CURRENT
IDD1 Supply Current
(includes load current)
RL = 100Ω, f = 85 MHz		 Checker Board Pattern,
Figure 2		 VDD33= 3.6V VDD33 148 170 mA
IDDIO1 VDDIO = 3.6V VDDIO 90 180 μA
VDDIO = 1.89V 1 1.6 mA
IDDS1 Supply Current Remote Auto Power Down Mode 0x01[7] = 1, deserializer is powered down VDD33 = 3.6V VDD33 1.2 2.4 mA
IDDIOS1 VDDIO = 3.6V VDDIO 65 150 μA
VDDIO = 1.89V 55 150 μA
IDDS2 Supply Current Power Down PDB = L, All LVCMOS inputs are floating or tied to GND VDD33 = 3.6V VDD33 1 2 mA
IDDIOS2 VDDIO = 3.6V VDDIO 65 150 μA
VDDIO = 1.89V 50 150 μA

6.6 AC Electrical Characteristics

Over recommended operating supply and temperature ranges unless otherwise specified.(1)(2)(3)
PARAMETER TEST CONDITIONS PIN/FREQ. MIN TYP MAX UNIT
GPIO BIT RATE
BR Forward Channel Bit Rate See(7)(4) f = 5 – 85 MHz
GPIO[3:0]		 0.25* f Mbps
Back Channel Bit Rate 75 kbps
RECOMMENDED TIMING for PCLK
tTCP PCLK Period See(7)(4) PCLK 11.76 T 200 ns
tCIH PCLK Input High Time 0.4*T 0.5*T 0.6*T ns
tCIL PCLK Input Low Time 0.4*T 0.5*T 0.6*T ns
tCLKT PCLK Input Transition Time
Figure 3(7)(4)		 f = 5 MHz 4.0 ns
f = 85 MHz 0.5 ns
tIJIT PCLK Input Jitter Tolerance,
Bit Error Rate ≤10–10		 f / 40 < Jitter Freq < f / 20(4)(5) f = 5 – 78MHz 0.4 0.6 UI
(1) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not ensured.
(2) Typical values represent most likely parametric norms at VDD = 3.3 V, TA = +25 °C, and at the Recommended Operating Conditions at the time of product characterization and are not ensured.
(3) Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground except VOD and ΔVOD, which are differential voltages.
(4) Specification is ensured by characterization and is not tested in production.
(5) Jitter Frequency is specified in conjunction with DS90UH926 PLL bandwidth.

6.7 DC and AC Serial Control Bus Characteristics

Over 3.3V supply and temperature ranges unless otherwise specified.(1)(2)(3)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIH Input High Level SDA and SCL 0.7*
VDD33		 VDD33 V
VIL Input Low Level Voltage SDA and SCL GND 0.3*
VDD33		 V
VHY Input Hysteresis >50 mV
VOL SDA, IOL = 1.25 mA 0 0.36 V
Iin SDA or SCL, VIN = VDD33 or GND -10 10 µA
tR SDA RiseTime – READ SDA, RPU = 10 kΩ, Cb ≤ 400 pF, see Figure 8 430 ns
tF SDA Fall Time – READ 20 ns
tSU;DAT Set Up Time — READ See Figure 8 560 ns
tHD;DAT Hold Up Time — READ See Figure 8 615 ns
tSP Input Filter 50 ns
Cin Input Capacitance SDA or SCL <5 pF
(1) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not ensured.
(2) Typical values represent most likely parametric norms at VDD = 3.3 V, TA = +25 °C, and at the Recommended Operating Conditions at the time of product characterization and are not ensured.
(3) Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground except VOD and ΔVOD, which are differential voltages.
(4) tPLD is the time required by the device to obtain lock when exiting power-down state with an active PCLK.
(5) UI – Unit Interval is equivalent to one serialized data bit width (1UI = 1 / 35*PCLK). The UI scales with PCLK frequency.
(6) Specification is ensured by characterization and is not tested in production.
(7) Specification is ensured by design and is not tested in production.

6.8 Recommended Timing for Serial Control Bus

Over 3.3V supply and temperature ranges unless otherwise specified.
MIN TYP MAX UNITS
fSCL SCL Clock Frequency Standard Mode 0 100 kHz
Fast Mode 0 400 kHz
tLOW SCL Low Period Standard Mode 4.7 us
Fast Mode 1.3 us
tHIGH SCL High Period Standard Mode 4.0 us
Fast Mode 0.6 us
tHD;STA Hold time for a start or a repeated start condition
Figure 8		 Standard Mode 4.0 us
Fast Mode 0.6 us
tSU:STA Set Up time for a start or a repeated start condition
Figure 8		 Standard Mode 4.7 us
Fast Mode 0.6 us
tHD;DAT Data Hold Time
Figure 8		 Standard Mode 0 3.45 us
Fast Mode 0 0.9 us
tSU;DAT Data Set Up Time
Figure 8		 Standard Mode 250 ns
Fast Mode 100 ns
tSU;STO Set Up Time for STOP Condition, Figure 8 Standard Mode 4.0 us
Fast Mode 0.6 us
tBUF Bus Free Time
Between STOP and START,
Figure 8		 Standard Mode 4.7 us
Fast Mode 1.3 us
tr SCL & SDA Rise Time,
Figure 8		 Standard Mode 1000 ns
Fast Mode 300 ns
tf SCL & SDA Fall Time,
Figure 8		 Standard Mode 300 ns
Fast mode 300 ns
30136362.gifFigure 1. Serializer VOD DC Output
30136346.gifFigure 2. Checkboard Data Pattern
30136330.gifFigure 3. Serializer Input Clock Transition Time
30136347.gifFigure 4. Serializer CML Output Load and Transition Time
30136361.gifFigure 5. Serializer Setup and Hold Times
30136349.gifFigure 6. Serializer Lock Time
30136348.gifFigure 7. Serializer CML Output Jitter
30136336.gifFigure 8. Serial Control Bus Timing Diagram

6.9 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tLHT CML Output Low-to-High Transition Time See Figure 4 DOUT+, DOUT- 80 130 ps
tHLT CML Output High-to-Low Transition Time 80 130 ps
tDIS Data Input Setup to PCLK See Figure 5 R[7:0], G[7:0], B[7:0], HS, VS, DE, PCLK, I2S_CLK, I2S_WC, I2S_DA, I2S_DB 2.0 ns
tDIH Data Input Hold from PCLK 2.0 ns
tPLD Serializer PLL Lock Time Figure 6(4) f = 5 – 85 MHz 131*T ns
tSD Delay — Latency f = 5 – 85 MHz 145*T ns
tTJIT Output Total Jitter,
Bit Error Rate ≥10-10
Figure 7(6)(7)(5)		 RL = 100Ω
f = 85MHz, LFMODE = L		 DOUT+, DOUT- 0.25 0.30 UI
RL = 100Ω
f = 5MHz, LFMODE = H		 0.25 0.30 UI

6.10 Typical Charateristics

wvfrm01_serial78_snls407.gif
Note: On the rising edge of each clock period, the CML driver outputs a low Stop bit, high Start bit, and 33 DC-scrambled data bits.
Figure 9. Serializer CML Driver Output
with 78 MHZ TX Pixel Clock
wvfrm02_PCLK78_snls407.gif
Figure 10. Comparison of Deserializer LVCMOS RX PCLK Output Locked to a 78 MHz TX PCLK