SLLSEU3B November   2016  – September 2018 ISO7730-Q1 , ISO7731-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature
  • Signaling Rate: Up to 100 Mbps
  • Wide Supply Range: 2.25 V to 5.5 V
  • 2.25-V to 5.5-V Level Translation
  • Default Output High and Low Options
  • Low Power Consumption, Typical 1.5 mA per Channel at 1 Mbps
  • Low Propagation Delay: 11 ns Typical
    (5-V Supplies)
  • High CMTI: ±100 kV/μs Typical
  • Robust Electromagnetic Compatibility (EMC)
    • System-Level ESD, EFT, and Surge Immunity
    • Low Emissions
  • Isolation Barrier Life: >40 Years
  • Wide-SOIC (DW-16) and QSOP (DBQ-16) Package Options
  • Safety-Related Certifications:
    • Reinforced Insulation per DIN V VDE V 0884-11:2017-01
    • 5000 VRMS (DW) and 2500 VRMS (DBQ) Isolation Rating per UL 1577
    • CSA Component Acceptance Notice 5A, IEC 60950-1 and IEC 60601-1 End Equipment Standards
    • CQC Certification per GB4943.1-2011
    • TUV Certification according to EN 60950-1 and EN 61010-1
    • All Certifications Complete except CQC Approval of DBQ-16 Package Devices