SWRS317 May   2023 IWR1843AOP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Revision History
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
      1. 6.3.1 Pin Functions - Digital and Analog [ALP Package]
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Power Supply Specifications
    6. 7.6  Power Consumption Summary
    7. 7.7  RF Specification
    8. 7.8  CPU Specifications
    9. 7.9  Thermal Resistance Characteristics for FCBGA Package [ALP0180A]
    10. 7.10 Timing and Switching Characteristics
      1. 7.10.1  Antenna Radiation Patterns
        1. 7.10.1.1 Antenna Radiation Patterns for Receiver
        2. 7.10.1.2 Antenna Radiation Patterns for Transmitter
      2. 7.10.2  Antenna Positions
      3. 7.10.3  Power Supply Sequencing and Reset Timing
      4. 7.10.4  Input Clocks and Oscillators
        1. 7.10.4.1 Clock Specifications
      5. 7.10.5  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 7.10.5.1 Peripheral Description
        2. 7.10.5.2 MibSPI Transmit and Receive RAM Organization
          1. 7.10.5.2.1 SPI Timing Conditions
          2. 7.10.5.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          3. 7.10.5.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
        3. 7.10.5.3 SPI Peripheral Mode I/O Timings
          1. 7.10.5.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        4. 7.10.5.4 Typical Interface Protocol Diagram (Peripheral Mode)
      6. 7.10.6  LVDS Interface Configuration
        1. 7.10.6.1 LVDS Interface Timings
      7. 7.10.7  General-Purpose Input/Output
        1. 7.10.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL) #GUID-A9917993-C388-4AAC-B9C6-6B2BF583E88E/T4362547-45 #GUID-A9917993-C388-4AAC-B9C6-6B2BF583E88E/T4362547-50
      8. 7.10.8  Controller Area Network Interface (DCAN)
        1. 7.10.8.1 Dynamic Characteristics for the DCANx TX and RX Pins
      9. 7.10.9  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 7.10.9.1 Dynamic Characteristics for the CANx TX and RX Pins
      10. 7.10.10 Serial Communication Interface (SCI)
        1. 7.10.10.1 SCI Timing Requirements
      11. 7.10.11 Inter-Integrated Circuit Interface (I2C)
        1. 7.10.11.1 I2C Timing Requirements #GUID-D26A1D00-D5E4-49AB-AFF7-B0ED1920A8A5/T4362547-185
      12. 7.10.12 Quad Serial Peripheral Interface (QSPI)
        1. 7.10.12.1 QSPI Timing Conditions
        2. 7.10.12.2 Timing Requirements for QSPI Input (Read) Timings #GUID-F4461E81-32E4-4CB7-B562-43AFC94843D1/T4362547-210 #GUID-F4461E81-32E4-4CB7-B562-43AFC94843D1/T4362547-209
        3. 7.10.12.3 QSPI Switching Characteristics
      13. 7.10.13 ETM Trace Interface
        1. 7.10.13.1 ETMTRACE Timing Conditions
        2. 7.10.13.2 ETM TRACE Switching Characteristics
      14. 7.10.14 Data Modification Module (DMM)
        1. 7.10.14.1 DMM Timing Requirements
      15. 7.10.15 JTAG Interface
        1. 7.10.15.1 JTAG Timing Conditions
        2. 7.10.15.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 7.10.15.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Subsystems
      1. 8.3.1 RF and Analog Subsystem
        1. 8.3.1.1 Clock Subsystem
        2. 8.3.1.2 Transmit Subsystem
        3. 8.3.1.3 Receive Subsystem
      2. 8.3.2 Processor Subsystem
      3. 8.3.3 Host Interface
      4. 8.3.4 Main Subsystem Cortex-R4F Memory Map
      5. 8.3.5 DSP Subsystem Memory Map
    4. 8.4 Other Subsystems
      1. 8.4.1 ADC Channels (Service) for User Application
        1. 8.4.1.1 GP-ADC Parameter
  10. 9 Monitoring and Diagnostics
    1. 9.1 Monitoring and Diagnostic Mechanisms
      1. 9.1.1 Error Signaling Module
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison

Table 5-1 shows a comparison between devices, highlighting the differences.

Table 5-1 Device Features Comparison
FUNCTIONIWR6843AOPIWR1843AOPIWR1843IWR1642IWR1443
Antenna on Package (AOP)YesYes———
Number of receivers44444
Number of transmitters33333323
RF frequency range60 to 64 GHz76 to 81 GHz76 to 81 GHz76 to 81 GHz76 to 81 GHz
On-chip memory1.75MB2MB2MB1.5MB576KB
Max I/F (Intermediate Frequency) (MHz)10101055
Max real sampling rate (Msps)25252512.512.5
Max complex sampling rate (Msps)12.512.512.56.256.25
Device Security1YesYesYesYes—
Processors
MCU (Arm Cortex-R4F)YesYesYesYesYes
DSP (C674x)YesYesYesYes—
Peripherals
Serial Peripheral Interface (SPI) ports22221
Quad Serial Peripheral Interface (QSPI)YesYesYesYesYes
Inter-Integrated Circuit (I2C) interface11111
Controller Area Network (DCAN) interface—1111
Controller Area Network (CAN-FD) interface2111—
TraceYesYesYesYes—
PWMYesYesYesYes—
Hardware In Loop (HIL/DMM)YesYesYesYes—
GPADCYesYesYesYesYes
LVDS/Debug2YesYesYesYesYes
Hardware acceleratorYesYesYes—Yes
1-V bypass modeYesYesYesYesYes
JTAGYesYesYesYesYes
Product statusProduct Preview (PP),
Advance Information (AI),
or Production Data (PD)		PD4PD4PD4PD4PD4
(1) Device security features including Secure Boot and Customer Programmable Keys are available in select devices for only select part variants as indicated by the Device Type identifier in Section 3, Device Information table.
(2) The LVDS interface is not a production interface and is only used for debug.
(3) 3 Tx Simultaneous operation is supported only with 1-V LDO bypass and PA LDO disable mode. In this mode, the 1-V supply needs to be fed on the VOUT PA pin.
(4) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty.