Single-chip 76-GHz to 81-GHz mmWave sensor integrating MCU and hardware accelerator
Product details
Parameters
Package | Pins | Size
Features
- FMCW Transceiver
- Integrated PLL, Transmitter, Receiver, Baseband, and A2D
- 76- to 81-GHz Coverage With 4-GHz Continuous Bandwidth
- Four Receive Channels
- Three Transmit Channels (Two Can be Used Simultaneously)
- Ultra-Accurate Chirp Engine Based on Fractional-N PLL
- TX Power: 12 dBm
- RX Noise Figure:
- 14 dB (76 to 77 GHz)
- 15 dB (77 to 81 GHz)
- Phase Noise at 1 MHz:
- –95 dBc/Hz (76 to 77 GHz)
- –93 dBc/Hz (77 to 81 GHz)
- Built-in Calibration and Self-Test
- ARM® Cortex®-R4F-Based Radio Control System
- Built-in Firmware (ROM)
- Self-calibrating System Across Frequency and Temperature
- On-Chip Programmable Core for Embedded User Application
- Integrated Cortex®-R4F Microcontroller Clocked at 200 MHz
- On-Chip Bootloader Supports Autonomous Mode (Loading User Application From QSPI Flash Memory)
- Integrated Peripherals
- Internal Memories With ECC
- Radar Hardware Accelerator (FFT, Log-magnitude Computations, and others)
- Integrated Timers (Watch Dog and up to Four 32-Bit or Two 64-Bit Timers)
- I2C (Master and Slave Modes Supported)
- Two SPI Ports
- CAN Port
- Up to Six General-Purpose ADC Ports
- High-Speed Data Interface to Support Distributed Applications
- Host Interface
- Control Interface With External Processor Over SPI
- Data Interface With External Processor Over MIPI D-PHY and CSI2 V1.1
- Interrupts for Fault Reporting
- IWR1443 Advanced Features
- Embedded Self-monitoring With No Host Processor Involvement
- Complex Baseband Architecture
- Embedded Interference Detection Capability
- Power Management
- Built-in LDO Network for Enhanced PSRR
- I/Os Support Dual Voltage 3.3 V/1.8 V
- Clock Source
- Supports External Oscillator at 40 MHz
- Supports Externally Driven Clock (Square/Sine) at 40 MHz
- Easy Hardware Design
- 0.65-mm Pitch, 161-Pin 10.4 mm × 10.4 mm Flip Chip BGA Package for Easy Assembly and Low-Cost PCB Design
- Small Solution Size
- Operating Conditions
- Junction Temp Range: –40°C to 105°C
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Description
The IWR1443 device is an integrated single-chip mmWave sensor based on FMCW radar technology capable of operation in the 76- to 81-GHz band with up to 4 GHz continuous chirp. The device is built with TI’s low-power 45-nm RFCMOS process, and this solution enables unprecedented levels of integration in an extremely small form factor. The IWR1443 is an ideal solution for low-power, self-monitored, ultra-accurate radar systems in the industrial applications such as building automation, factory automation, drones, material handling, traffic monitoring, and surveillance.
The IWR1443 device is a self-contained, single-chip solution that simplifies the implementation of mmWave sensors in the band of 76 to 81 GHz. The IWR1443 includes a monolithic implementation of a 3TX, 4RX system with built-in PLL and A2D converters. The device includes fully configurable hardware accelerator that supports complex FFT and CFAR detection. Additionally, the device includes two ARM R4F-based processor subsystems: one processor subsystem is for master control, and additional algorithms; a second processor subsystem is responsible for front-end configuration, control, and calibration. Simple programming model changes can enable a wide variety of sensor implementation with the possibility of dynamic reconfiguration for implementing a multimode sensor. Additionally, the device is provided as a complete platform solution including reference hardware design, software drivers, sample configurations, API guide, training, and user documentation.
Award-winning sensors available now
IWR1443 is part of TI's award-winning mmWave sensor portfolio. Recent acknowledgements include:
- CES 2018 Innovation Award Honoree in three categories
- Electronic Products 2017 Product of the Year in the sensing category
- 2017 Annual Creativity in Electronics (ACE) Award for Sensor of the Year
- Elektronik 2018 Reader’s Choice Product of the Year in active components category
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The DCA1000 evaluation module (EVM) provides real-time data capture and streaming for two- and four-lane low-voltage differential signaling (LVDS) traffic from TI AWR and IWR radar sensor EVMs. The data can be streamed out via 1-Gbps Ethernet in real time to a PC running the MMWAVE-STUDIO tool for (...)
Features
- Supports lab and mobile collection scenarios
- Captures LVDS data from AWR/IWR radar sensors
- Streams output in real time through 1-Gbps Ethernet
- Controlled via onboard switches or GUI/library
Description
The IWR1443 BoosterPack™ plug-in module is an easy-to-use 77GHz mmWave sensor evaluation board for the single-chip IWR1443 mmWave sensing device, with direct connectivity to the TI MCU LaunchPad™ development-kit ecosystem.
IWR1443BOOST contains everything required to start developing on a low-power (...)
Features
- Onboard antenna enables field testing
- XDS110-based JTAG with serial-port interface for flash programming
- UART-to-USB interface for control, configuration, and data visualization
- TI LaunchPad development-kit interface to seamlessly connect to TI MCUs
- CAN connector enables direct interface to car units
Description
The Texas Instruments XDS110 is a new class of debug probe (emulator) for TI embedded processors. The XDS110 replaces the XDS100 family while supporting a wider variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a single pod. Also, all XDS debug probes support Core and System Trace in all ARM and (...)
Features
The XDS110 is the latest entry level debug probe (emulators) for TI embedded processors. Designed to be a complete solution that delivers JTAG and SWD connectivity at a low cost, the XDS110 is the debug probe of choice for entry-level debugging of TI microcontrollers, processors and SimpleLink (...)
Description
The XDS200 is a debug probe (emulator) used for debugging TI embedded devices. The XDS200 features a balance of low cost with good performance as compared to the low cost XDS110 and the high performance XDS560v2. It supports a wide variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a (...)
Features
The XDS200 is the mid-range family of JTAG debug probes (emulators) for TI processors. Designed to deliver good performance and the most common features that place it between the low cost XDS110 and the high performance XDS560v2, the XDS200 is the balanced solution to debug TI microcontrollers (...)
Description
The XDS560v2 System Trace is the first model of the XDS560v2 family of high-performance debug probes (emulators) for TI processors. The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).
The (...)
Features
XDS560v2 is the latest variant of the XDS560 family of high-performance debug probes (emulators) for TI processors. With the fastest speeds and most features of the entire XDS family, XDS560v2 is the most comprehensive solution to debug TI microcontrollers, processors and wireless connectivity (...)
Description
The XDS560v2 System Trace is the first model of the XDS560v2 family of high-performance debug probes (emulators) for TI processors. The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).
The (...)
Features
-
XDS560v2 is the latest variant of the XDS560 family of high-performance debug probes (emulators) for TI processors. With the fastest speeds and most features of the entire XDS family, XDS560v2 is the most comprehensive solution to debug TI microcontrollers, processors and wireless connectivity (...)
Description
The XDS560v2 PRO TRACE Receiver is the latest model of the XDS560v2 family of high-performance debug probes (emulators) for TI processors. The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).
The (...)
Features
XDS560v2 is the latest variant of the XDS560 family of high-performance debug probes (emulators) for TI processors. With the fastest speeds and most features of the entire XDS family, XDS560v2 is the most comprehensive solution to debug TI microcontrollers, processors and wireless connectivity (...)
Software development
MMWAVE-SDK
The mmWave software development kit (SDK) is a unified software platform for the TI mmWave Sensing Portfolio, providing easy setup and fast out-of-the-box access to (...)
Features
- Building blocks
- Full driver availability
- Layered approach to programming analog front end (AFE)
- Catalog of mmWave algorithms optimized for C674x DSPs
- Demonstrations and examples
- TI RTOS-based demos
- Out-of-box demo with easy configurability via TI cloud-based GUI
- Representation of "point cloud" and (...)
Features
By platform - Find out more about the features available for a specific microcontroller and processor family:
Features
- mmWave Studio
- Post-processing of ADC data and visualization of processed data
- Board control (SOP change, reset control)
- RS-232 connection and firmware download
- Configures mmWave sensors using radar API commands
- Interface to DCA1000EVM for raw ADC data capture
- mmWave Sensing Estimator
- Enables calculation of (...)
Features
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Interactive and intuitive graphical tool for enabling, configuring and generating initialization code for pinmuxing, TI Drivers and stack configuration (Bluetooth® Low Energy, ZigBee®, Thread, TI-15.4, EasyLink and NDK)
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Real-time conflict management to ensure developers are creating a valid system (...)
CCS Uniflash is a standalone tool used to (...)
Design tools & simulation
Features
- Many IWR/AWR devices supported
- Search by application, country, or technical parameters
- Links and contacts for quick engagement
- Third-party companies located around the world
Reference designs
Design files
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download Power Optimization for 77GHz Level Transmitter Assembly Files.zip (352KB) -
download Power Optimization for 77GHz Level Transmitter Layer Plots.zip (4177KB) -
download Power Optimization for 77GHz Level Transmitter Gerber.zip (2253KB) -
download Power Optimization for 77GHz Level Transmitter Altium (Rev. A).zip (513KB) -
download Power Optimization for 77GHz Level Transmitter BOM (Rev. A).pdf (73KB) -
download Chirp Budget Calc_09_10_18.zip (52KB) -
download Chirp Budget Calc_09_25_18.zip (53KB)
Design files
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download IWR1443BOOST Layout and Design Files.zip (23527KB) -
download AM57x EVM BOM (Rev. C).zip (3449KB) -
download AM57x EVM Assembly Files (Rev. C).zip (2803KB) -
download AM57x EVM Schematic Source (Rev. C).zip (13029KB) -
download AM57x EVM PCB (Rev. C).zip (30879KB) -
download xWR1843BOOST Schematic, Assembly Files, and BOM (Rev. D).zip (5333KB) -
download xWR6843 EVM Altium Design Files, Fabrication & Assembly Package (Rev. C).zip (121397KB)
Design files
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download TIDEP-01003 Gerber.zip (300KB) -
download TIDEP-01003 PCB.pdf (788KB) -
download TIDEP-01003 Assembly Drawing.pdf (161KB) -
download TIDEP-01003 BOM.pdf (84KB)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| FC/CSP (ABL) | 161 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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