SNVS100F March   2000  – July 2014 LM2937

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: LM2937-5
    6. 6.6  Electrical Characteristics: LM2937-8
    7. 6.7  Electrical Characteristics: LM2937-10
    8. 6.8  Electrical Characteristics: LM2937-12
    9. 6.9  Electrical Characteristics: LM2937-15
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Thermal Shutdown (TSD)
      2. 7.3.2 Short Circuit Current Limit
      3. 7.3.3 Overvoltage Shutdown (OVSD)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
        2. 8.2.2.2 Output Capacitor ESR
        3. 8.2.2.3 Heatsinking
        4. 8.2.2.4 Heatsinking TO-220 Package Parts
        5. 8.2.2.5 Heatsinking DDPAK/TO-263 and SOT-223 Package Parts
        6. 8.2.2.6 SOT-223 Soldering Recommendations
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

TO-220 Plastic Package (NDE)
3
Top View
TO-220-3_snvsa54.gif
SOT-223 Plastic Package (DCY)
4
Top View
SOT-223-4_snvsa54.gif
DDPAK/TO-263 Surface-Mount Package (KTT)
3
Top View
TO-263-3_snvsa54.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NDE KTT DCY
INPUT 1 1 1 I Unregulated voltage input
GND 2 2 2 — Ground
OUTPUT 3 3 3 O Regulated voltage output. This pin requires an output capacitor to maintain stability. See the Detailed Design Procedure section for output capacitor details.
GND TAB TAB 4 — Thermal and ground connection. Connect the TAB to a large copper area to remove heat from the device. The TAB is internally connected to device pin 2 (GND). Connect the TAB to GND or leave floating. Do not connect the TAB to any potential other than GND at device pin 2.