SNVS970C March   2013  – October 2014 LM3279

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 System Characteristics Recommended Capacitance Specifications
    8. 6.8 Typical Performance Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Dynamically Adjustable Output Voltage
      2. 7.3.2  Seamless Mode Transition
      3. 7.3.3  Setting The Output Voltage
      4. 7.3.4  General Purpose Outputs
      5. 7.3.5  VCONON
      6. 7.3.6  RDSON Management
      7. 7.3.7  Supply Current Limit
      8. 7.3.8  Reverse Current Limit
      9. 7.3.9  VCON Overvoltage Clamp
      10. 7.3.10 Thermal Overload Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable And Shutdown Mode
      2. 7.4.2 Low-Power Mode
      3. 7.4.3 Standby Mode
      4. 7.4.4 PFM Mode
    5. 7.5 Programming
      1. 7.5.1 Digital Control Serial Bus Interface
      2. 7.5.2 Supported Command Sequences
      3. 7.5.3 Device Enumeration
      4. 7.5.4 I/O
      5. 7.5.5 Control Interface Timing Parameters
    6. 7.6 Registers
      1. 7.6.1 Programmable Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Typical Application Circuit: Digital Control
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Output Current Capability
          2. 8.2.1.2.2 Recommended External Components
            1. 8.2.1.2.2.1 Inductor Selection
            2. 8.2.1.2.2.2 Input Capacitor Selection
          3. 8.2.1.2.3 Output Capacitor Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application Circuit: Analog Control
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB
        1. 10.1.1.1 Energy Efficiency
        2. 10.1.1.2 EMI
    2. 10.2 Layout Examples
      1. 10.2.1 LM3279 RF Evaluation Board
      2. 10.2.2 Component Placement
    3. 10.3 DSBGA Package Assembly And Use
    4. 10.4 Manufacturing Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (November 2013) to C Revision

  • Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves sectionGo

Changes from A Revision (May 2013) to B Revision

  • Changed Analog control 0.6V to 0.5VGo
  • Changed 0.2V ≤ VCON ≤ 1.4V to 0.167V ≤ VCON ≤ 1.4VGo
  • Changed 0.2 V to 0.167 VGo
  • Changed 0.6 V to 3.4 V to 1.6 V to 3.4 VGo
  • Changed 200 from max. to typ.Go
  • Changed 0.2V (min.) to 1.4V (max. typ.) to 0.167V (min.) to 1.4V (max. typ.); from 0.6V to 4.2V output to from 0.5V to 4.2V outputGo
  • Added (default)Go
  • Added (default)Go