SNVS450F September   2006  – October 2015 LM3402 , LM3402HV

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Controlled ON-time Overview
      2. 7.3.2 Average LED Current Accuracy
      3. 7.3.3 Maximum Output Voltage
      4. 7.3.4 Minimum Output Voltage
      5. 7.3.5 High Voltage Bias Regulator
      6. 7.3.6 Internal MOSFET and Driver
      7. 7.3.7 Fast Shutdown for PWM Dimming
      8. 7.3.8 Peak Current Limit
      9. 7.3.9 Overvoltage and Overcurrent Comparator
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low Power Shutdown
      2. 7.4.2 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Switching Frequency
      2. 8.1.2 LED Ripple Current
      3. 8.1.3 Buck Converters Without Output Capacitors
      4. 8.1.4 Buck Converters With Output Capacitors
      5. 8.1.5 Input Capacitors
      6. 8.1.6 Recirculating Diode
      7. 8.1.7 LED Current During DIM Mode
      8. 8.1.8 Transient Protection Considerations
        1. 8.1.8.1 CS Pin Protection
        2. 8.1.8.2 CS Pin Protection With OVP
        3. 8.1.8.3 VIN Pin Protection
        4. 8.1.8.4 General Comments Regarding Other Pins
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 RON and tON
        2. 8.2.2.2 Using an Output Capacitor
        3. 8.2.2.3 Output Inductor
          1. 8.2.2.3.1 RSNS
        4. 8.2.2.4 Input Capacitor
        5. 8.2.2.5 Recirculating Diode
          1. 8.2.2.5.1 CB and CF
        6. 8.2.2.6 Efficiency
        7. 8.2.2.7 Die Temperature
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Compact Layout
      2. 10.1.2 Ground Plane and Shape Routing
      3. 10.1.3 Current Sensing
      4. 10.1.4 Remote LED Arrays
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VIN to GND LM3402 –0.3 45 V
LM3402HV –0.3 76
BOOT to GND LM3402 –0.3 59 V
LM3402HV –0.3 90
SW to GND LM3402 –1.5 V
LM3402HV –1.5
BOOT to VCC LM3402 –0.3 45 V
LM3402HV –0.3 76
BOOT to SW –0.3 14 V
VCC to GND –0.3 14 V
DIM to GND –0.3 7 V
CS to GND –0.3 7 V
RON to GND –0.3 7 V
Soldering information Lead temperature (soldering, 10 s) 260 °C
Infrared/convection reflow (15 s) 235 °C
Junction temperature 150 °C
Storage temperature –65 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.

6.2 ESD Ratings

VALUE UNIT
LM3402
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
LM3402HV
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN LM3402 6 42 V
LM3402HV 6 75
Junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) LM3402, LM3402HV UNIT
DDA (HSOP) DGK (VSSOP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 45.6 154.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 53.1 48.2 °C/W
RθJB Junction-to-board thermal resistance 25.8 74.2 °C/W
ψJT Junction-to-top characterization parameter 7.6 4.3 °C/W
ψJB Junction-to-board characterization parameter 25.7 72.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.2 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

VIN = 24 V unless otherwise indicated. Typical values apply over –40°C ≤ TJ ≤ 125°C; minimum and maximum values apply over the full operating temperature range (2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
REGULATION AND OVERVOLTAGE COMPARATORS
VREF-REG CS Regulation Threshold CS Decreasing, SW turns on 194 200 206 mV
VREF-0V CS Overvoltage Threshold CS Increasing, SW turns off 300 mV
ICS CS Bias Current CS = 0 V 0.1 µA
SHUTDOWN
VSD-TH Shutdown Threshold RON / SD Increasing 0.3 0.7 1.05 V
VSD-HYS Shutdown Hysteresis RON / SD Decreasing 40 mV
OFF TIMER
tOFF-MIN Minimum OFF-time CS = 0 V 300 ns
INTERNAL REGULATOR
VCC-REG VCC Regulated Output 6.6 7 7.4 V
VIN-DO VIN - VCC Dropout ICC = 5 mA, 6 V < VIN < 8 V 300 mV
VCC-BP-TH VCC Bypass Threshold VIN Increasing 8.8 V
VCC-BP-HYS VCC Bypass Hysteresis VIN Decreasing 225 mV
VCC-Z-6 VCC Output Impedance
(0 mA < ICC < 5 mA)		 VIN = 6 V 55 Ω
VCC-Z-8 VIN = 8 V 50
VCC-Z-24 VIN = 24 V 0.4
VCC-LIM VCC Current Limit (1) VIN = 24 V, VCC = 0 V 16 mA
VCC-UV-TH VCC Undervoltage Lock-out Threshold VCC Increasing 5.25 V
VCC-UV-HYS VCC Undervoltage Lock-out Hysteresis VCC Decreasing 150 mV
VCC-UV-DLY VCC Undervoltage Lock-out Filter Delay 100-mV Overdrive 3 µs
IIN-OP IIN Operating Current Non-switching, CS = 0 V 600 900 µA
IIN-SD IIN Shutdown Current RON / SD = 0 V 90 180 µA
CURRENT LIMIT
ILIM Current Limit Threshold 530 735 940 mA
DIM COMPARATOR
VIH Logic High DIM Increasing 2.2 V
VIL Logic Low DIM Decreasing 0.8 V
IDIM-PU DIM Pullup Current DIM = 1.5 V 75 µA
N-MOSFET AND DRIVER
RDS-ON Buck Switch ON Resistance ISW = 200 mA, BOOT-SW = 6.3 V 0.7 1.5 Ω
VDR-UVLO BOOT Undervoltage Lockout Threshold BOOT–SW Increasing 1.7 3 4 V
VDR-HYS BOOT Undervoltage Lockout Hysteresis BOOT–SW Decreasing 400 mV
THERMAL SHUTDOWN
TSD Thermal Shutdown Threshold 165 °C
TSD-HYS Thermal Shutdown Hysteresis 25 °C
(1) VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading.
(2) Typical specifications represent the most likely parametric norm at 25°C operation.

6.6 Timing Requirements

MIN NOM MAX UNIT
tON-1 ON-time 1, VIN = 10 V, RON = 200 kΩ 2.1 2.75 3.4 µs
tON-2 ON-time 2, VIN = 40 V, RON = 200 kΩ LM3402 490 650 810 ns
ON-time 2, VIN = 70 V, RON = 200 kΩ LM3402HV 290 380 470

6.7 Typical Characteristics

LM3402 LM3402HV 20192129.png
Figure 1. VREF vs Temperature (VIN = 24 V)
LM3402 LM3402HV 20192131.png
Figure 3. VREF vs VIN, LM3402HV (TA = 25°C)
LM3402 LM3402HV 20192133.png
Figure 5. Current Limit vs VIN, LM3402 (TA = 25°C)
LM3402 LM3402HV 20192135.png
Figure 7. TON vs VIN, RON = 100 kΩ (TA = 25°C)
LM3402 LM3402HV 20192137.png
Figure 9. TON vs VIN, (TA = 25°C)
LM3402 LM3402HV 20192138.png
Figure 11. TON vs RON, LM3402HV (TA = 25°C)
LM3402 LM3402HV 20192140.png
Figure 13. VO-MAX vs fSW, LM3402 (TA = 25°C)
LM3402 LM3402HV 20192142.png
Figure 15. VO-MAX vs fSW, LM3402HV (TA = 25°C)
LM3402 LM3402HV 20192130.png
Figure 2. VREF vs VIN, LM3402 (TA = 25°C)
LM3402 LM3402HV 20192132.png
Figure 4. Current Limit vs Temperature (VIN = 24 V)
LM3402 LM3402HV 20192134.png
Figure 6. Current Limit vs VIN, LM3402HV (TA = 25°C)
LM3402 LM3402HV 20192136.png
Figure 8. TON vs VIN (TA = 25°C)
LM3402 LM3402HV 20192144.png
Figure 10. TON vs RON, LM3402 (TA = 25°C)
LM3402 LM3402HV 20192139.png
Figure 12. VCC vs VIN (TA = 25°C)
LM3402 LM3402HV 20192141.png
Figure 14. VO-MIN vs fSW, LM3402 (TA = 25°C)
LM3402 LM3402HV 20192143.png
Figure 16. VO-MIN vs fSW, LM3402HV (TA = 25°C)