SNOS724F August   2000  – February 2024 LMC6492 , LMC6494

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Input Common-Mode Voltage Range
      2. 6.1.2 Rail-to-Rail Output
      3. 6.1.3 Compensating for Input Capacitance
      4. 6.1.4 Capacitive Load Tolerance
    2. 6.2 Typical Application
      1. 6.2.1 Application Circuits
    3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
        1. 6.3.1.1 Printed Circuit Board Layout For High-Impedance Work
  8. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 Spice Macromodel
        2. 7.1.1.2 PSpice® for TI
        3. 7.1.1.3 TINA-TI™ Simulation Software (Free Download)
        4. 7.1.1.4 DIP-Adapter-EVM
        5. 7.1.1.5 DIYAMP-EVM
        6. 7.1.1.6 TI Reference Designs
        7. 7.1.1.7 Filter Design Tool
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4.     Trademarks
    5. 7.4 Electrostatic Discharge Caution
    6. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted (1)(2)
MIN MAX UNIT
Differential input voltage   ±Supply Voltage
Voltage at input/output pin  (V–) – 0.3 (V+) + 0.3 V
VS Supply voltage, VS = (V+) – (V–) 16 V
Current at input pin –5 5 mA
Current at output pin (3) –30 30 mA
Current at power supply pin 40 mA
Lead temperature (soldering, 10 sec) 260 °C
TSTG Storage temperature –65 150 °C
TJ Junction temperature (4) 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) If military- or aerospace-specified devices are required, please contact the TI Sales Office or Distributors for availability and specifications.
(3) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30mA over a long term can adversely affect reliability.
(4) The maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max) − TA) / θJA. All numbers apply for packages soldered directly into a printed circuit board (PCB).