SLUSF82 January   2024 LMG3100R017

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
  7. 6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Propagation Delay and Mismatch Measurement
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Control Inputs
      2. 8.3.2 Start-up and UVLO
      3. 8.3.3 Bootstrap Supply Voltage Clamping
      4. 8.3.4 Level Shift
    4. 8.4 Device Functional Modes
  10.   Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 VCC Bypass Capacitor
        2. 9.2.2.2 Bootstrap Capacitor
        3. 9.2.2.3 Slew Rate Control
        4. 9.2.2.4 Use With Analog Controllers
        5. 9.2.2.5 Power Dissipation
    3.     Power Supply Recommendations
    4. 9.3 Layout
      1. 9.3.1 Layout Guidelines
      2. 9.3.2 Layout Examples
  11. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  12. 10Revision History
  13. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Information
    2. 11.2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • VBE|15
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2.2 Bootstrap Capacitor

The bootstrap capacitor provides the gate charge for the high-side gate drive, dc bias power for HB UVLO circuit, and the reverse recovery charge of the bootstrap diode. The required bypass capacitance can be calculated using Equation 2.

Equation 2. CBST = (QG + QRR + ICC * tON(max)) / ΔV

where

  • ICC is the quiescent current of the high side device
  • tON(maximum) is the maximum on-time period of the high-side gate driver
  • QRR is the reverse recovery charge of the bootstrap diode
  • QG is the gate charge of the high-side GaN FET
  • ΔV is the permissible ripple in the bootstrap capacitor (< 100 mV, typical)

A 0.3-µF, 16-V, 0402 ceramic capacitor is suitable for most applications. Place the bootstrap capacitor as close as possible to the HB and HS pins.