SNOSC84D Data sheet

SNOSC84D August 2012 – February 2015 LMH6882

PRODUCTION DATA.

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)

NJK|36

Thermal pad, mechanical data (Package|Pins)

Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings⁽¹⁾⁽²⁾

	MIN	MAX	UNIT
Positive supply voltage (VCC)	−0.6	5.5	V
Differential voltage between any two grounds		< 200	mV
Analog input voltage	−0.6	5.5	V
Digital input voltage	−0.6	5.5	V
Output short circuit duration (one pin to ground)		Infinite
Junction temperature		+150	°C
Soldering information: infrared or convection (30 sec)		260	°C
Storage temperature, T_stg	−65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±1000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±250	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

	MIN	MAX	UNIT
Supply voltage (VCC)	4.75	5.25	V
Differential voltage between any two grounds		< 10	mV
Analog input voltage, AC coupled	0	VCC	V
Temperature range ⁽¹⁾	–40	85	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LMH6882	UNIT
		NJK (WQFN)
		36 PINS
R_θJA	Junction-to-ambient thermal resistance	33.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	16.9
R_θJB	Junction-to-board thermal resistance	7.8
ψ_JT	Junction-to-top characterization parameter	0.3
ψ_JB	Junction-to-board characterization parameter	7.7
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	3.5

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

The following specifications apply for single supply with VCC = 5 V, Maximum Gain (26 dB), R_L = 200 Ω.⁽²⁾⁽⁵⁾⁽⁶⁾

		TEST CONDITIONS	MIN⁽⁴⁾	TYP⁽³⁾	MAX⁽⁴⁾	UNIT
DYNAMIC PERFORMANCE
3dBBW	−3-dB Bandwidth	V_OUT = 2 V_PPD		2.4		GHz
NF	Noise Figure	Source Resistance (Rs) = 100 Ω		9.7		dB
OIP3	Output Third Order Intercept Point⁽⁹⁾	f = 100 MHz, P_OUT = 4 dBm per tone, tone spacing = 1 MHz		42		dBm
OIP3	Output Third Order Intercept Point⁽⁹⁾	f = 200 MHz, P_OUT = 4 dBm per tone, tone spacing = 2 MHz		40		dBm
OIP2	Output Second Order Intercept Point	P_OUT= 4 dBm per Tone, f1 = 112.5 MHz, f2=187.5 MHz		76		dBm
IMD3	Third Order Intermodulation Products	f = 100 MHz, V_OUT = 4 dBm per tone, tone spacing = 1 MHz		−76		dBc
IMD3	Third Order Intermodulation Products	f = 200 MHz, P_OUT = 4 dBm per tone, tone spacing = 2 MHz		−72		dBc
P1dB	1-dB Compression Point	Output power		17		dBm
HD2	Second Order Harmonic Distortion	f = 200 MHz, V_OUT = 4 dBm		−70		dBc
HD3	Third Order Harmonic Distortion	f = 200 MHz, P_OUT = 4 dBm		−76		dBc
CMRR	Common Mode Rejection Ratio ⁽⁸⁾	Pin = −15 dBm, f = 100 MHz		−40		dBc
SR	Slew Rate			6000		V/us
	Output Voltage Noise	Maximum Gain f > 1 MHz		47		nV/√Hz
	Input Referred Voltage Noise	Maximum Gain f > 1 MHz		2.3		nV/√Hz
ANALOG I/O
R_IN	Input Resistance	Differential, INPD to INMD		100		Ω
R_IN	Input Resistance	Single Ended, INPS or INMS, 50-Ω termination on unused input		50		Ω
V_ICM	Input Common Mode Voltage	Self Biased		2.5		V
	Maximum Input Voltage Swing	Volts peak to peak, differential		2		V_PPD
	Maximum Differential Output Voltage Swing	Differential, f < 10 MHz		6		V_PPD
R_OUT	Output Resistance	Differential, f = 100 MHz		0.4		Ω
GAIN PARAMETERS
	Maximum Voltage Gain	Parallel Inputs (INPD and INMD), Rs = 100 Ω		26		dB
	Maximum Voltage Gain	Single ended input (INMS or INPS), 50 Ω Rs and 50 Ω termination on unused input.		26.6		dB
	Minimum Gain	Gain Code = 80d or 50h		6		dB
	Gain Steps			80
	Gain Step Size			0.25		dB
	Gain Step Error	Any two adjacent steps over entire range		±0.125		dB
	Gain Step Phase Shift	Any two adjacent steps over entire range		±3		Degrees
	Channel to Channel Gain Matching	f = 100 MHz, over entire gain range		0.2		dB
	Channel to Channel Phase Matching	f= 100 MHz, over entire gain range		1.5		Degrees
	Gain Step Switching Time			20		ns
	Enable/ Disable Time	Settled to 90% level		15		ns
POWER REQUIREMENTS
ICC	Supply Current			200	270	mA
P	Power			1		W
ICC	Disabled Supply Current			25		mA
ALL DIGITAL INPUTS
	Logic Compatibility	TTL, 2.5 V CMOS, 3.3 V CMOS, 5 V CMOS
VIL	Logic Input Low Voltage			0.4		V
VIH	Logic Input High Voltage			2.0-5.0		V
IIH	Logic Input High Input Current			−9		μA
IIL	Logic Input Low Input Current			−47		μA
PARALLEL MODE TIMING
t_GS	Setup Time			3		ns
t_GH	Hold Time			3		ns
SERIAL MODE
f_CLK	SPI Clock Frequency	50% duty cycle, ATE tested @ 10 MHz	10	50		MHz

(1) The maximum power dissipation is a function of T_J(MAX), θ_JA and the ambient temperature T_A. The maximum allowable power dissipation at any ambient temperature is P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.

(2) Electrical Table values apply only for factory testing conditions at the temperature indicated. No specification of parametric performance is indicated in the electrical tables under conditions different than those tested

(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material.

(4) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC) methods.

(5) Negative input current implies current flowing out of the device.

(6) Drift determined by dividing the change in parameter at temperature extremes by the total temperature change.

(7) LMH6881 devices have been used for some typical performance plots.

(8) CMRR is defined as the differential response at the output in response to a common mode signal at the input.

(9) OIP3 is the third order intermodulation intercept point. In this data sheet OIP3 numbers are single power measurements where OIP3 = IMD3 / 2 + POUT (per tone). OIP2 is the second order intercept point where OIP2 = IMD2 + POUT (per tone). HD2 is the second order harmonic distortion and is a single tone measurement. HD3 is the third order harmonic distortion and is a single tone measurement. Power measurements are made at the amplifier output pins.